AUTOMOTIVE CLEANING POLISHING PREPARATIONS

Brand Owner (click to sort) Address Description
C.A.R. PRODUCTS, INC. C.A.R. PRODUCTS, INC. 630 Beaulieu Street Holyoke MA 01040 Automotive cleaning and polishing preparations, namely, all purpose cleaners, glass cleaners, interior cleaners, car wash soaps, wheel cleaners, white wall cleaners, engine cleaners, tar removing preparations, finish sealants for use on the interior and exterior of automobiles to protect surfaces from the elements, polishes, wax, spray on detergents, detergents, foaming detergent for use on the exterior of the automobile, drying agent, and sealants for use on the exterior of automobiles to protect surfaces from the elements, all for use on automobiles in commercial car washes and by individuals;CAR PRODUCTS INC;C.A.R. PRODUCTS INC.;The lining is a feature of the mark and does not indicate color.;
MASTER LINE Blue Coral Chemical, Inc. 4775 South Butterfield Drive, Suite 175 Tucson AZ 85714 automotive cleaning and polishing preparations;
NO.7 NITEO PRODUCTS 5949 SHERRY LANE SUITE 540 DALLAS TX 75225 automotive cleaning and polishing preparations; tar and bug remover for automobiles;
NO7 NITEO PRODUCTS 5949 SHERRY LANE SUITE 540 DALLAS TX 75225 automotive cleaning and polishing preparations; chrome polish for automobiles;
NULENS MOTHERS POLISHES WAXES CLEANERS 5456 Industrial Drive Huntington Beach CA 92649 AUTOMOTIVE CLEANING AND POLISHING PREPARATIONS; KITS COMPRISING POLISHING COMPOUNDS, SANDPAPER AND BUFFING PADS FOR CLEANING AND POLISHING AUTOMOBILES AND MOTOR VEHICLES;
SERIOUSLY WET Illinois Tool Works Inc. 155 Harlem Avenue Glenview IL 60025 automotive cleaning and polishing preparations; silicone protectant for automobile tires; tire and wheel cleaners; tire care and finishing preparations;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. A polishing pad is cleaned of Cu CMP by-products, subsequent to planarizing a wafer, to reduce pad-glazing by applying to the polishing pad surface a composition comprising about 0.1 to about 3.0 wt. % of at least one organic compound having one or more amine or amide groups, an acid or a base in an amount sufficient to adjust the pH of the composition to about 5.0 to about 12.0, the remainder water. Embodiments comprise ex situ cleaning of a rotating polishing pad by applying a solution having a pH of about 5.0 to about 12.0 at a flow rate of about 100 to about 600 ml/min. for about 3 to about 20 seconds after polishing a wafer having a Cu-containing surface and then removing the cleaning solution from the polishing pad by high pressure rinsing with water.