BALLS USED IN BEARINGS

Brand Owner (click to sort) Address Description
ATLAS SKF USA INC. Corporate Headquarters 890 Forty Foot Road, PO Box 352 Lansdale PA 19446 BALLS USED IN BEARINGS, ROLLERS USED IN BEARINGS, BALLS USED IN MACHINES-NAMELY, [ SHOE MACHINERY, PEARL AND ] BONE BUTTON MACHINERY, AIRCRAFT ENGINES, FLOOR SURFACING MACHINERY, TOBACCO WEIGHING AND FILLING MACHINERY, SPRAYERS, WOODWORKING MACHINERY, [ ADDRESSING AND DUPLICATING MACHINES, ] MACHINE TOOLS, COAL CONVEYING MACHINERY, ASH CONVEYING MACHINERY, MILKING MACHINERY, TRACTORS, CARBURETORS,LAUNDRY MACHINERY, AIR BRAKES, GREASE AND OIL GUNS, PLASTIC MOLDING MACHINERY, PUMPS, DRILLING MACHINES, METAL PUNCHING AND EMBOSSING MACHINERY, THRESHING MACHINES, FIRE EXTINGUISHERS, LOCOMOTIVE BOOSTERS AND METAL BALLS USED IN GRINDING, BURNISHING, SIZING, AND POLISHING;
ATLAS SKF USA INC. Corporate Headquarters 890 Forty Foot Road, PO Box 352 Lansdale PA 19446 BALLS USED IN BEARINGS, ROLLERS USED IN BEARINGS, BALLS USED IN MACHINES-NAMELY, SHOE MACHINERY, PEARL AND BONE BUTTON MACHINERY, AIRCRAFT ENGINES, FLOOR SURFACING MACHINERY, TOBACCO WEIGHING AND FILLING MACHINERY, SPRAYERS, WOODWORKING MACHINERY, ADDRESSING AND DUPLICATING MACHINES, MACHINE TOOLS, COAL CONVEYING MACHINERY, ASH CONVEYING MACHINERY, MILKING MACHINERY, TRACTORS, CARBURETORS, LAUNDRY MACHINERY, AIR BRAKES, GREASE AND OIL GUNS, PLASTIC MOLDING MACHINERY, PUMPS, DRILLING MACHINES, METAL PUNCHING AND EMBOSSING MACHINERY, THRESHING MACHINES, FIRE EXTINGUISHERS, LOCOMOTIVE BOOSTERS AND METAL BALLS USED IN GRINDING, BURNISHING, SIZING, AND POLISHING;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. A method of packaging an integrated circuit die includes the steps of loading an array of soft conductive balls into recesses formed in a platen and locating the platen in a first part of a mold cavity. A second part of the mold is pressed against the balls to flatten a surface of the balls. A first mold compound then is injected into the mold cavity such that the mold compound surrounds exposed portions of the balls. The balls are removed from the platen and a first side of an integrated circuit die is attached to the balls. Die bonding pads on a second side of the die are electrically connected to respective ones of the balls surrounding the die, and then the die, the electrical connections, and a top portion of the conductive balls is encapsulated with a second mold compound.