COMPUTER CHIP CONDUCTING HIGH

Brand Owner Address Description
ADDRESS PROCESSOR KAWASAKI STEEL CORPORATION No. 1-28, Kitahonmachidori 1-Chome Chuo-ku, Kobe Japan computer chip for conducting high speed parallel search operations on memory tables while simultaneously capturing and manipulating data from a data stream;
 

Where the owner name is not linked, that owner no longer owns the brand

   
Technical Examples
  1. A transistor structure includes at least one chip; a packaging insulating layer, a first adhesive layer, a conducting layer, and a second adhesive layer sequentially provided on one side of the chip having electrical contacts thereon, so that the conducting layer is bonded between the first and the second adhesive layer; and a leadframe bonded to an outer side of the second adhesive layer. The conducting layer may be a metal sheet, a metal film, or a type of conducting fiber. The leadframe is connected to the electrical contacts on the chip via lead wires, and at least one of the electrical contacts on the chip is connected to the conducting layer via a conductor, so that the conducting layer is able to isolate electrical noises and reduce electromagnetic interferences, improve rates of transmission and heat release, strengthen chip packaging structure, and serve as a common grounding circuit.