ELECTRONIC MICRO ELECTRONIC SILICON CHIPS

Brand Owner (click to sort) Address Description
CG ALCHIMER 15 rue du Buisson aux Fraises France Electronic and micro-electronic silicon chips, semiconductor chips, semiconductor devices, integrated circuits;Machines for the coating of surfaces by laying chemicals thereon for their functionalization; machines for the manufacture and treatment of integrated circuits, semiconductor devices and chips;Color is not claimed as a feature of the mark.;Chemicals for use in industry and science; chemical preparations for use in surface functionalization namely chemical preparations for the coating of material surfaces for giving new functions to surfaces or improving their properties, for use in industry;
EG ALCHIMER 15 rue du Buisson aux Fraises France ELECTRONIC AND MICRO-ELECTRONIC SILICON CHIPS, SEMICONDUCTOR CHIPS, SEMICONDUCTOR DEVICES, INTEGRATED CIRCUITS;MACHINES AND MACHINE TOOLS FOR INDUSTRIAL USE FOR SURFACE FUNCTIONALIZATION; MACHINES AND MACHINE TOOLS FOR INDUSTRIAL USE FOR THE MANUFACTURE AND TREATMENT OF INTEGRATED CIRCUITS, SEMICONDUCTOR DEVISES AND CHIPS;CHEMICALS FOR USE IN INDUSTRY AND SCIENCE; CHEMICAL PREPARATIONS FOR USE IN SURFACE FUNCTIONALIZATION, NAMELY, CHEMICAL PREPARATIONS FOR THE COATING OF SURFACES FOR GIVING NEW FUNCTIONS TO SURFACES OR IMPROVING THEIR PROPERTIES FOR USE IN INDUSTRY;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. Apparatus and methods are provided for integrating microchannel cooling modules within high-density electronic modules (e.g., chip packages, system-on-a-package modules, etc.,) comprising multiple high-performance IC chips. Electronic modules are designed such that high-performance (high power) IC chips are disposed in close proximity to the integrated cooling module (or cooling plate) for effective heat extraction. Moreover, electronic modules which comprise large surface area silicon carriers with multiple chips face mounted thereon are designed such that integrated silicon cooling modules are rigidly bonded to the back surfaces of such chips to increase the structural integrity of the silicon carriers.