INTEGRATED CIRCUITS ICS

Brand Owner (click to sort) Address Description
ARANUA KONINKLIJKE PHILIPS ELECTRONICS N.V. High Tech Campus 5 Eindhoven 5656 AE Netherlands INTEGRATED CIRCUITS (ICS), COMPUTER CHIPS AND SEMICONDUCTORS; MICROPROCESSORS; EMBEDDED SOFTWARE FOR USE TO MULTIMEDIA IMAGE PROCESSING; COMPUTER HARDWARE; MULTIMEDIA HARDWARE; REPROGRAMMABLE CHIPS; PRINTED CIRCUIT BOARDS;
BLUEBERRY NXP B.V. High Tech Campus 60 Eindhoven 5656AG Netherlands INTEGRATED CIRCUITS (ICs), CHIPS, DIODES, TRANSISTORS, AND SEMICONDUCTORS;BLUE BERRY;
CLEAR@MOTION NXP B.V. High Tech Campus 60 Eindhoven 5656AG Netherlands INTEGRATED CIRCUITS (ICs), SEMICONDUCTORS AND SEMICONDUCTOR CHIPS;CLEAR AT MOTION;
D AMPLIFIER KONINKLIJKE PHILIPS ELECTRONICS N.V. High Tech Campus 5 Eindhoven 5656 AE Netherlands INTEGRATED CIRCUITS (ICS), SEMICONDUCTOR AND SILICON CHIPS, TRANSISTORS, AND SEMICONDUCTORS; SOFTWARE FOR PROCESSING AUDIO SIGNALS;AMPLIFIER;
NIGHTSENSE BOSCH SICHERHEITSSYSTEME GMBH Robert-Bosch-Platz 1 Gerlingen D-70839 Germany INTEGRATED CIRCUITS (ICS), VIDEO PROCESSING CHIPS, TRANSISTORS AND SEMICONDUCTORS;NIGHT SENSE;
P-LAN REALTEK SEMICONDUCTOR CORP. NO.2, INNOVATION ROAD II HSINCHU SCIENCE PARK HSINCHU 300 R.O.C. Taiwan Integrated circuits (ICs); Chips (integrated circuits); Printed circuit boards; UWB (Ultra Wideband); WLAN (wireless LAN); Wireless Projectors; Wireless Printers; Wireless Cameras; Cellular phones; Cordless phones; TV tuner; Cable TV tuner; Cable modem; Handheld Personal Digital Assistant; Palm pilot; Network interface cards; Wireless communications products; Receivers; Transmitters;PLAN;
P-LAN REALTEK SEMICONDUCTOR CORP. NO.2, INNOVATION ROAD II HSINCHU SCIENCE PARK HSINCHU 300 R.O.C. Taiwan Integrated circuits (ICs); Chips (integrated circuits); Printed circuit boards; UWB (Ultra Wideband); WLAN (wireless LAN); Wireless Projectors; Wireless Printers; Wireless Cameras; Cellular phones; Cordless phones; TV tuner; Cable TV tuner; Cable modem; Handheld Personal Digital Assistant; Palm pilot; Network interface cards; Wireless communications products; Receivers; Transmitters;PLAN;
QLPAK NXP B.V. High Tech Campus 60 Eindhoven 5656AG Netherlands INTEGRATED CIRCUITS (ICs), CHIPS, DIODES, TRANSISTORS, AND SEMICONDUCTORS;QL PACK;
SEMPULSE SEMTECH CORPORATION 200 Flynn Road Camarillo CA 93012 Integrated circuits (ICs), semiconductor devices used to convert one voltage to another and used to provide a fixed voltage output over a wide range of current, voltage regulators, voltage references, light emitting diode (LED) drivers, driver ICs, and electronic devices, namely, regulators used to provide fast responses to changes in output loading;SEMTECH PULSE;
UCODE NXP B.V. High Tech Campus 60 Eindhoven 5656AG Netherlands Integrated circuits (ICs), computer chips and semiconductors used in barcode labeling, in supply chain management and logistics.;YOU CODE;
XSAW WIONICS RESEARCH 16269 LAGUNA CANYON RD. IRVINE CA 92618 Integrated circuits (ICs), microchips, printed circuit boards, wireless local area network hardware, cellular phones, cordless phones, TV tuner, cable TV converters, cable modem, handheld personal digital assistant, palm pilot, network interface cards bearing integrated circuits, wireless communication products, namely TV transmitters and receivers; wireless transmitters and receivers for wireless local area networks;The mark consists of the characters XSAW, with a grey shadowing behind the letters; the letter X is red, the letters SAW are black, and there are three parallel wavy black lines across the X, with the highest and lowest line being crossed at the center by shorter lines.;The color(s) red, black and grey is/are claimed as a feature of the mark.;
XSAW Orion Microelectronics Corporation 108 Pacifica, Suite 270 Irvine CA 92618 Integrated circuits (ICs), microchips, printed circuit boards, wireless local area network hardware, cellular phones, cordless phones, TV tuner, cable TV converters, cable modem, handheld personal digital assistant, palm pilot, network interface cards bearing integrated circuits, wireless communication products, namely TV transmitters and receivers; wireless transmitters and receivers for wireless local area networks;The mark consists of the characters XSAW, with a grey shadowing behind the letters; the letter X is red, the letters SAW are black, and there are three parallel wavy black lines across the X, with the highest and lowest line being crossed at the center by shorter lines.;The color(s) red, black and grey is/are claimed as a feature of the mark.;
 

Where the owner name is not linked, that owner no longer owns the brand

   
Technical Examples
  1. The invention provides a sealing layer that seals metal bonding structures between three dimensional bonded integrated circuits from a surrounding environment. A material may be applied to fill a volume between the bonded integrated circuits or seal the perimeter of the volume between the bonded integrated circuits. The material may be the same material as that used for underfilling the volume between the bottom integrated circuit and a substrate.