Where the owner name is not linked, that owner no longer owns the brand
Technical Examples
An IC embedding seat comprises a body and a sliding cover to form a sliding mechanism provided for IC with BGA package no longer using SMT, soldering paste, or flux for IC maintenance and replacement, the body has one or more IC containers each of which bottom has a conducting pin array formed by a plurality of conducting pin units with elasticity and conductivity arrayed in matrix arrangement, and the sliding cover is constructed a cover to the body with sliding movement to open or close the body, so that the IC is easily embedded into the IC container of the body to get a well electrical connection with the corresponding conducting pin units of the body after simply sliding the sliding cover to close the body, and without de-soldering process the embedded IC is freely removed from the IC container by sliding the sliding cover to open the body.