PRINTED STANDARDS

Brand Owner (click to sort) Address Description
COMMITTEE T1 Alliance For Telecommunications Industry Solutions, Inc. Suite 500 1200 G Street, NW Washington DC 20005 Printed standards, printed reports and printed requirements, all in the field of telecommunications and information technology;COMMITTEE TELECOMMUNICATIONS ONE;T1;Technical research in the field of telecommunications, namely development and dissemination of technical and operational standards and requirements applicable to telecommunications and information technology;
ESIF Alliance For Telecommunications Industry Solutions, Inc. Suite 500 1200 G Street, NW Washington DC 20005 Printed standards, printed reports and printed requirements, all in the field of telecommunications and information technology;EMERGENCY SERVICES INTERCONNECTION FORUM;Technical research in the field of telecommunications, namely development and dissemination of technical and operational standards and requirements applicable to telecommunications and information technology;
GSSB Stichting Global Reporting Initiative Barbara Strozzilaan 336 Amsterdam 1083HN Netherlands Downloadable electronic publications in the nature of printed standards, guides, and research reports featuring the best practices and techniques for an organization to report its sustainable development, or its ability to meet the economic, environmental and social needs of the present without compromising its ability to meet these same needs in the future, and its sustainability performance related thereto, to stakeholders;
OBF Alliance For Telecommunications Industry Solutions, Inc. Suite 500 1200 G Street, NW Washington DC 20005 Printed standards, printed reports and printed requirements, all in the field of telecommunications and information technology;Providing information in the field of technical and operational standards and guidelines applicable to telecommunications;ORDERING AND BILLING FORUM;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. Techniques that enable the transitioning of high frequency signals on a printed wiring board processed in accordance with industry standards (such as the IPC specifications) are disclosed. One embodiment provides a high frequency via structure for a printed wiring board, where the via structure includes a via pad configured in accordance with IPC standards. A printed microwave transmission line having an inductive section is connected to the via pad, wherein the inductive section has dimensions to compensate for transition discontinuity.