DICLAD

Welcome to the Brand page for “DICLAD”, which is offered here for Electronic circuit materials, polymer composite laminates and bonding films for use in fabricating recognized printed wiring boards, all being structural components of the foregoing goods used to fabricate electronic circuits; electronic circuit material, a dielectric substrate clad on one or both sides with a conductive layer for fabricating electronic circuits or unclad for use as a bonding layer, all being structural components of the foregoing goods used to fabricate electronic circuits;electronic circuit material, an insulated dielectric substrate material which is clad on one or both sides with a conductive layer for fabricating electronic circuits; polymeric materials sold in sheet form, rods, blocks and other stock shapes, for use by third party manufacturers; microwave laminates and bonding films for use in manufacturing electronic circuitry; fiber reinforced plastic materials in extruded, molded and machined shapes for use in manufacture;.

Its status is currently believed to be active. Its class is unavailable. “DICLAD” is believed to be currently owned by “ROGERS CORPORATION”.

Owner:
ROGERS CORPORATION
Owner Details
Description:
Electronic circuit materials, polymer composite laminates and bonding films for use in fabricating recognized printed wiring boards, all being structural components of the foregoing goods used to fabricate electronic circuits; electronic circuit material, a dielectric substrate clad on one or both sides with a conductive layer for fabricating electronic circuits or unclad for use as a bonding layer, all being structural components of the foregoing goods used to fabricate electronic circuits;Electronic circuit material, an insulated dielectric substrate material which is clad on one or both sides with a conductive layer for fabricating electronic circuits; Polymeric materials sold in sheet form, rods, blocks and other stock shapes, for use by third party manufacturers; microwave laminates and bonding films for use in manufacturing electronic circuitry; Fiber Reinforced Plastic Materials in Extruded, Molded and Machined Shapes for Use in Manufacture;
Categories: ELECTRONIC CIRCUIT MATERIALS