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Welcome to the Brand page for “ASSEMBLY TECHNOLOGIES”, which is offered here for Automatic epoxy die attach equipment used in the manufacture of microelectronic circuits, the bonding of microelectronic circuit chips to lead frames and the electro-optical inspection of the finished product, programmable dicing saws used in the manufacture of microelectronic circuits and other high precision devices;automatic epoxy die attach equipment used in the manufacture of microelectronic circuits, the bonding of microelectronic circuit chips to lead frames and the electro-optical inspection of the finished product, programmable dicing saws used in the manufacture of microelectronic circuits and other high precision devices;maintenance and repair services for automatic epoxy die attach equipment used in the manufacture of microelectronic circuits, the bonding of microelectronic circuit chips to lead frams and the electro-optical inspection of the finished product and programmable dicing saws used in the manufacture of microelectronic circuits and other high precision devices;.
Its status is currently believed to be active. Its class is unavailable. “ASSEMBLY TECHNOLOGIES” is believed to be currently owned by “GENERAL SIGNAL TECHNOLOGY CORPORATION”.
| Owner: |
GENERAL SIGNAL TECHNOLOGY CORPORATION
Owner Details |
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| Description: |
Automatic epoxy die attach equipment used in the manufacture of microelectronic circuits, the bonding of microelectronic circuit chips to lead frames and the electro-optical inspection of the finished product, programmable dicing saws used in the manufacture of microelectronic circuits and other high precision devices;automatic epoxy die attach equipment used in the manufacture of microelectronic circuits, the bonding of microelectronic circuit chips to lead frames and the electro-optical inspection of the finished product, programmable dicing saws used in the manufacture of microelectronic circuits and other high precision devices;maintenance and repair services for automatic epoxy die attach equipment used in the manufacture of microelectronic circuits, the bonding of microelectronic circuit chips to lead frams and the electro-optical inspection of the finished product and programmable dicing saws used in the manufacture of microelectronic circuits and other high precision devices;
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| Categories: | AUTOMATIC EPOXY DIE ATTACH EQUIPMENT |