BGA

Welcome to the Brand page for “BGA”, which is offered here for Thermoplastic and thermoset resins used for electronic computer chip packages; encapsulants and sealants made of silica and epoxy used as a protective coating for electronic components;.

Its status is currently believed to be active. Its class is unavailable. “BGA” is believed to be currently owned by “TESSERA, INC.”

Owner:
TESSERA, INC.
Owner Details
Description:
Thermoplastic and thermoset resins used for electronic computer chip packages; encapsulants and sealants made of silica and epoxy used as a protective coating for electronic components;
Categories: THERMOPLASTIC THERMOSET RESINS USED