Brands and Their Owners
Welcome to the Brand page for “BULC”, which is offered here for Substrates for semi-conductors, supporting board on which integrated circuits, chip condensers and chip capacitors are attached or in which integrated circuits, chip condensers and chip capacitors are embedded; glazed substrates for thermal printer heads, supporting boards that are attached in thermal printer heads; polyimide thin film multilayer substrates for semi-conductors, supporting material on which integrated circuits, chip condensers and chip capacitors are attached-- integrated circuits and circuits boards for semi-conductors; chip packages, protective housings for semiconductor chips attached to printed circuit boards; crystal resonator saw (surface acoustic wave) filter package, protective housings for crystal resonator; saw(surface acoustic wave) and filter; leadless chip carriers; interposers for semi-conductors, connecters for semi-conductors; printed circuit boards; flexible printed circuit boards; printed wiring boards; pin grid array chip packages, supporting boards on which pins are gridded arrayed; ball grid array chip packages, supporting boards on which balls are gridded arrayed; flat packages, housings for integrated circuits; multi-chip module substrates, supporting board on which integrated circuits, chip condensers, chip capacitors, chip resisters and chip inductors are installed; packages for high frequency band, protective housings working in high frequency band area; aluminum nitride products, ceramic housings and supporting boards used in the manufacture of integrated circuits; cerdips, ceramic housings and supporting boards used in the manufacture of integrated circuits; printed wiring for use in connecting semiconductor components on printed circuit boards; multilayer printed circuit boards;bulk;.
Its status is currently believed to be active. Its class is unavailable. “BULC” is believed to be currently owned by “NGK SPARK PLUG CO., LTD.”
Owner: |
NGK SPARK PLUG CO., LTD.
Owner Details |
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Description: |
Substrates for semi-conductors, supporting board on which integrated circuits, chip condensers and chip capacitors are attached or in which integrated circuits, chip condensers and chip capacitors are embedded; glazed substrates for thermal printer heads, supporting boards that are attached in thermal printer heads; polyimide thin film multilayer substrates for semi-conductors, supporting material on which integrated circuits, chip condensers and chip capacitors are attached-- integrated circuits and circuits boards for semi-conductors; chip packages, protective housings for semiconductor chips attached to printed circuit boards; crystal resonator SAW (Surface Acoustic Wave) filter package, protective housings for crystal resonator; SAW(Surface Acoustic Wave) and filter; leadless chip carriers; interposers for semi-conductors, connecters for semi-conductors; printed circuit boards; flexible printed circuit boards; printed wiring boards; pin grid array chip packages, supporting boards on which pins are gridded arrayed; ball grid array chip packages, supporting boards on which balls are gridded arrayed; flat packages, housings for integrated circuits; multi-chip module substrates, supporting board on which integrated circuits, chip condensers, chip capacitors, chip resisters and chip inductors are installed; packages for high frequency band, protective housings working in high frequency band area; aluminum nitride products, ceramic housings and supporting boards used in the manufacture of integrated circuits; cerdips, ceramic housings and supporting boards used in the manufacture of integrated circuits; printed wiring for use in connecting semiconductor components on printed circuit boards; multilayer printed circuit boards;BULK;
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Categories: | SUBSTRATES SEMI CONDUCTORS |