ACOUSTIC INSULATION MATERIALS

Brand Owner (click to sort) Address Description
SOUNDBLOC PERGO (EUROPE) AB 160 South Industrial Blvd. Calhoun GA 30701 acoustic insulation materials in the form of boards or rolls; sound damping base material for floor covering, namely boards or rolls of plastic foam, wood fiber or felt; framework sound damping base for floor; sound damping materials for floors, namely boards or rolls of plastic foam, wood fiber or felt; floor covering material consisting of a thermosetting laminate or a thermoplastic laminate and any of these laminates bonded to an insulating sheet; foam plastic insulation in the form of a roll; polyethylene film use as a vapor barrier;base sheet for floor covering; floor covering materials consisting of a theremosetting laminate or a thermoplastic laminate and any of these laminates bonded to a base of particle board or fiber board;SOUND BLOCK;
VISAGE AUTEX INDUSTRIES LIMITED 702-718 Rosebank Road, Avondale Auckland 1026 New Zealand Acoustic insulation materials; acoustic insulating sound absorption panels, screens and partitions; materials for acoustic insulation; sound absorbing insulation materials; sound absorbing wall coverings, namely, sound absorbing insulation materials; sound insulating materials for walls, screens, panels and partitions; fabrics for acoustic insulation; insulating felt for use in the commercial furniture industry;Felts; non-woven textile fabrics for use with acoustic insulation products; textile fabrics and fabrics for use in the manufacture of sound absorbing wall coverings, wall hangings, screens, partitions and panels;The English translation of VISAGE in the mark is face in French.;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. A method of producing a surface acoustic wave device includes the steps of forming a first electrode film for constituting an interdigital electrode, a wiring electrode, and an electrode pad on the piezoelectric substrate, forming an insulation film on the piezoelectric substrate so as to cover the first electrode film, patterning the insulation film so that the insulation film existing on the portion of the first electrode film onto which a second electrode film is to be laminated is removed, forming the second electrode film on the portion of the first electrode film from which the insulation film has been removed, and bonding a bump onto the second electrode film.