ADDITION AGENTS USED IN COPPER

Brand	Owner	Address	Description
CUFLEX	ATOTECH DEUTSCHLAND GMBH	Erasmusstrasse 20 Berlin 10553 Germany	ADDITION AGENTS USED IN COPPER ELECTROPLATING SOLUTIONS TO IMPROVE THE BRIGHTNESS OF ELECTRODEPOSITED COPPER;COPPERFLEX;
	Where the owner name is not linked, that owner no longer owns the brand

Technical Examples

The surface treatment agent for copper and copper alloys contains hydrogen peroxide, a mineral acid, an azole compound, silver ion and a halide ion. The surface treatment agent for copper and copper alloys is useful in the production of printed wiring boards in electronics industry. The surface treatment agent roughens the surface of copper and copper alloys. Particularly, the surface treatment agent can form a uniform and undulation-free roughened surface on copper-clad substrates having plated mirror surface, this having been difficult in conventional techniques, thereby significantly improving the adhesion to etching resists, solder resists, in addition, to prepregs and a resin for mounting electronic parts.