ADHESIVE BACKED NOTE PADS

Brand Owner (click to sort) Address Description
ACTION AMPAD CORPORATION 75 APPLETON ST. HOLYOKE MA 01041 adhesive backed note pads;
FAXFLAG AMPAD CORPORATION 75 APPLETON ST. HOLYOKE MA 01041 adhesive backed note pads;fax flag;
FAXFLAG AMPAD CORPORATION 75 APPLETON ST. HOLYOKE MA 01041 adhesive backed note pads;
PLEASE NOTE LEPAGE'S INCORPORATED Pittsburgh PA adhesive backed note pads;
QUIK NOTES JUMOLI 1486 CALLALILY WAY SANDY UT 84092 ADHESIVE BACKED NOTE PADS;QUICK NOTES;NOTES;
SLINKY POOF-SLINKY 40 Lane Road Fairfield NJ 07004 Adhesive-backed note pads;
TAKE NOTE! KITARU INNOVATIONS INC. 30E Lower Halcyon Heights Lascelles, St. James BB24016 Barbados adhesive backed note pads;
TIX INTERNATIONAL CUBE CORPORATION 122 E. 42ND STREET NEW YORK NY 10017 ADHESIVE-BACKED NOTE PADS;TICK;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. A semiconductor package comprises a chip having a top surface for chip pads and a bottom surface opposite the top surface. The top and bottom surfaces define side surfaces. The package further includes an adhesive layer provided within a chip-attaching area substantially defined by side surfaces of the chip and attaches a chip to, for example, a substrate having substrate pads. This prevents the contamination of the substrate pads by the adhesive layer. In one embodiment, the adhesive layer has at least one hole formed therethrough to expose a portion of the bottom surface of the chip. The adhesive layer may include at least one passage laterally connecting the hole to the outside. Alternatively, the adhesive layer has a plurality of adhesive parts separately disposed on the semiconductor chip.