ADHESIVES FOR INDUSTRIAL USE

Brand Owner (click to sort) Address Description
ACRYLOCK PIERCE & STEVENS CHEMICAL CORP. 710 OHIO ST. BUFFALO NY Adhesives for Industrial Use;
CROSLENE Takeda Chemical Industries, Ltd. 1-1, Doshomachi 4-Chome, Chuo-Ku Osaka Japan ADHESIVES FOR INDUSTRIAL USE;PLASTICS IN THE FORM OF POWDERS, PASTES, LIQUIDS, EMULSIONS, DISPERSIONS AND GRANULATES, ALL FOR INDUSTRIAL USE; SYNTHETIC RESINS; SYNTHETIC RUBBER LATEXES FOR INDUSTRIAL USE;
EPOXYLAB Tra-Con, Inc. 55 North St. Medford MA 02155 Adhesives for Industrial Use;
ESCOWELD EXXON CORPORATION Flemington NJ ADHESIVES FOR INDUSTRIAL USE;
EXXON EXXON CORPORATION Flemington NJ ADHESIVES FOR INDUSTRIAL USE;NOV. 13, 1967 IN A DIFFERENT FORM.;NOV. 13, 1967 IN A DIFFERENT FORM.;
FURA-PACK M & T CHEMICALS, INC. Woodbridge Township NJ ADHESIVES FOR INDUSTRIAL USE;
GLOY ASSOCIATED ADHESIVES LIMITED TRADING ESTATE GALVIN ROAD SLOUGH ADHESIVES FOR INDUSTRIAL USE, HOUSEHOLD USE, GENERAL USE AND USE ON PAPER;
GULF GULF OIL CORPORATION Pittsburgh PA ADHESIVES FOR INDUSTRIAL USE;THE DRAWING IS MARKED TO INDICATE THE COLORS ORANGE AND BLUE, BUT COLOR IS NOT AN ESSENTIAL FEATURE OF THE MARK.;
GULF GULF OIL CORPORATION Pittsburgh PA ADHESIVES FOR INDUSTRIAL USE;
KSM KSM FASTENING SYSTEMS INC. 301 NEW ALBANY ROAD MOORESTOWN NJ 08057 ADHESIVES FOR INDUSTRIAL USE;
LORD LORD CORPORATION 111 Lord Drive Cary NC 27511 Adhesives for Industrial Use;
MEGABOND ASHLAND OIL, INC. Russell KY Adhesives for Industrial Use;
OMNIFIT OmniTECHNIC GmbH Munich 50 8000 Germany Adhesives for Industrial Use;
POLYWELD TREMCO INCORPORATED 3735 Green Road Beachwood OH 44122 Adhesives for Industrial Use;
T TRULOC LIMITED UNIT T24 STILLORGAN INDUSTRIAL ESTATE BLACKROCK, DUBLIN, IRELAND Ireland ADHESIVES FOR INDUSTRIAL USE;
WESTERN AMERICAN Western/American, Inc. 225 Grand Ave. Kansas City MO 64106 Adhesives for Industrial Use;
 

Where the owner name is not linked, that owner no longer owns the brand

   
Technical Examples
  1. The present invention relates to b-stageable die attach adhesives, methods of preparing such adhesives, methods of applying such adhesives to the die and other substrate surfaces, and assemblies prepared therewith for connecting microelectronic circuitry.