AIR CONDITIONING SYSTEMS COMPRISING

Brand Owner (click to sort) Address Description
9 LINE S.E.E.R. EUBANK MANUFACTURING ENTERPRISES, INC. P.O. Box 7938 Lonqview TX 75607 AIR CONDITIONING SYSTEMS COMPRISING AN EVAPORATOR, CONDENSER, COMPRESSOR AND INTERCONNECTING LINES AND INSTRUMENTATION;S.E.E.R.;
EOS AIR SYSTEM COMPONENTS, INC. 605 Shiloh Road Plano TX 75074 Air conditioning systems comprising [ grilles, registers, ] diffusers [, volume control dampers, non-return dampers, back draft dampers, gravity shutters, louvers, sand trap louvers, variable air valves, fan coil units, fire dampers, motorized smoke and fire dampers, jet nozzles ] and swirl diffusers;
TITUS PHILIPS INDUSTRIES INC. 4801 SPRINGFIELD STREET P.O. BOX 943 DAYTON OH 45401 AIR CONDITIONING SYSTEMS COMPRISING, GRILLS, REGISTERS, DIFFUSERS, LOUVRES, DAMPERS, AIR DISTRIBUTION ASSEMBLIES, AIR MIXING ASSEMBLIES AND AIR VOLUME CONTROL ASSEMBLIES;
TITUS AIR SYSTEM COMPONENTS, INC. 605 Shiloh Road Plano TX 75074 AIR CONDITIONING SYSTEMS COMPRISING, GRILLS, REGISTERS, DIFFUSERS, LOUVRES, DAMPERS, AIR DISTRIBUTION ASSEMBLIES, AIR MIXING ASSEMBLIES AND AIR VOLUME CONTROL ASSEMBLIES SOLD AS A UNIT;
 

Where the owner name is not linked, that owner no longer owns the brand

   
Technical Examples
  1. Conditioning devices, systems and methods for conditioning a contact surface of a processing pad used in processing microelectronic workpieces. One embodiment of a conditioning device comprises an end-effector having a conditioning surface configured to engage the contact surface of the processing pad and a plurality of microstructures on the conditioning surface. The microstructures can be arranged in a pattern corresponding to a desired pattern of microfeatures on the contact surface of the processing pad. In several embodiments, the microstructures are raised elements projecting from the conditioning surface and/or depressions in the conditioning surface. The condition surface can also be smooth. The conditioning device can also include a heater coupled to the end-effector for heating the processing pad.