ALL PURPOSE POLISHING COMPOUND

Brand Owner (click to sort) Address Description
FARECLA FARECLA PRODUCTS LIMITED Broadmeads, Ware Hertfordshire SG129HS United Kingdom all purpose polishing compound and abrasive rubbing compound for surface finishing;polishing pads, wool mops, and sponge apparatus for cleaning;
FARECLA FARECLA PRODUCTS LIMITED Broadmeads, Ware Hertfordshire SG129HS United Kingdom All purpose polishing compound and abrasive rubbing compound for surface finishing;Polishing pads, wool mops, and sponge apparatus for cleaning;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. A method for chemical mechanical polishing (CMP) wafers having high aspect ratio surface topography. A wafer is positioned on a plate. A polishing pad is coupled to a platen. A polishing solution (e.g., slurry) is added between the polishing pad and the wafer. CMP is performed on the wafer by creating a relative movement between the polishing pad and the wafer. The polishing pad removes substantially all residual material from the channels. To accomplish this, the polishing pad has a compressibility of at least 5% at a polishing pressure of about 4 psi.