APPARATUS FOR RECEIVING EXPOSED FILM

Brand	Owner (click to sort)	Address	Description
APM	DELPHI TECHNOLOGY, INC.	1117 PERIMETER CENTER WEST, N307 ATLANTA GA 30338	APPARATUS FOR RECEIVING EXPOSED FILM FOR DEVELOPMENT AND DISPENSING UNEXPOSED FILM AND PROCESSED PRINTS;
AUTOMATED PHOTO MACHINE	DELPHI TECHNOLOGY, INC.	1117 PERIMETER CENTER WEST, N307 ATLANTA GA 30338	APPARATUS FOR RECEIVING EXPOSED FILM FOR DEVELOPMENT AND DISPENSING UNEXPOSED FILM AND PROCESSED PRINTS;AUTOMATED PHOTOGRAPH MACHINE;AUTOMATED OR MACHINE;
	Where the owner name is not linked, that owner no longer owns the brand

Technical Examples

An SiC film, a porous silica film as an interlayer dielectric film, another SiC film, an SiO2 film, an SiN film, and an antireflection film are formed in this order on an interlayer dielectric film and Cu film. The antireflection film is coated with an organic photosensitive ArF resist, and the resist is exposed and developed to form a resist mask in which a wiring trench pattern is formed. A trench is then formed in the porous silica film, the latter SiC film, the SiO2 film, and the SiN film. Plasma processing using a hydrogen-containing gas is performed on the side surfaces of the porous silica film, thereby forming a modified layer. The exposed portion of the former SiC film is etched away to allow the trench to reach the Cu film.