ATHLETIC BALLS

Brand Owner (click to sort) Address Description
BADEN BADEN SPORTS, INC. 3401 Lind Avenue SW Renton WA 98057 Athletic balls, namely, basketballs, footballs, soccer balls, volleyballs, baseballs, and playground balls;Color is not claimed as a feature of the mark.;
D DIVERSITECH GENERAL DIVERSITECH GENERAL, INC. 175 GHENT RD. AKRON OH 44313 ATHLETIC BALLS;DIVERSIFY TECH GENERAL DIVERSITY TECH GENERAL;
GETSOMEBALLS GETSOMEBALLS.COM, INC. 95 Stallion Circle Upper Holland PA 19053 ATHLETIC BALLS, NAMELY, SOCCER BALLS;CUSTOM IMPRINTING OF ATHLETIC BALLS WITH DECORATIVE DESIGNS;
INTIMIDATOR FRANKLIN SPORTS INDUSTRIES, INC. Stoughton MA athletic balls;
KILLSPENCER SPENCER THOMAS NIKOSEY 188 Dapplegray Road Bell Canyon CA 91307 Athletic balls, namely, leather athletic sports balls; leather play balls, medicine balls, heavy battle ropes for exercise and muscle building, heavy boxing bags, basketballs, speed bags for boxing, basketball kits comprising backboard, rim and net, basketball hoops, boxing swivel, footballs, soccer balls;KILL SPENCER;Hats, caps, baseball hats;
KING OF THE BEACH ASCHER, JR, MR STEPHEN YOUNT 70 S LAKE AVENUE SUITE 630 PASADENA CA 91101 athletic balls, namely, volleyballs;
PROFESSIONAL SIGNATURE SERIES HAT WORLD, INC. 7676 Interactive Way Indianapolis IN 46278 ATHLETIC BALLS, NAMELY, BASEBALLS AND SOFTBALLS; INFLATABLE BALLS FOR RECREATIONAL USE;SERIES;
STREETJAM KRANSCO P.O. BOX 884866 160 PACIFIC AVENUE SAN FRANCISCO CA 94118 athletic balls; namely, footballs, basketballs and baseballs;STREET JAM;
TROPHY BALL LOUSTALOT, JON L 4256 LOMA RIVIERA LN SAN DIEGO CA 92110 ATHLETIC BALLS;
VOIT W. J. VOIT RUBBER CORP. 1600 EAST 25TH STREET LOS ANGELES CA ATHLETIC BALLS, AND EXERCISE, SWIMMING, SKIN AND SCUBA DIVING, WATER SKI, [GOLF], AND OTHER ATHLETIC, SPORTS OR GAME EQUIPMENT AND ACCESSORIES;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. A method of packaging an integrated circuit die includes the steps of loading an array of soft conductive balls into recesses formed in a platen and locating the platen in a first part of a mold cavity. A second part of the mold is pressed against the balls to flatten a surface of the balls. A first mold compound then is injected into the mold cavity such that the mold compound surrounds exposed portions of the balls. The balls are removed from the platen and a first side of an integrated circuit die is attached to the balls. Die bonding pads on a second side of the die are electrically connected to respective ones of the balls surrounding the die, and then the die, the electrical connections, and a top portion of the conductive balls is encapsulated with a second mold compound.