BASE CUT

Brand Owner Address Description
BASECUT Mirka Ltd Pensalavägen 210 FI-66850 Jepua Finland BASE CUT;Abrasives, namely, coated abrasives in the nature of [ abrasive film to which abrasive grains are attached, flexible abrasives in the nature of abrasive film to which abrasive grains are attached, abrasive film to which abrasive grains are attached, coated abrasives in the nature of abrasive net to which abrasive grains are attached, flexible abrasives in the nature of abrasive net to which abrasive grains are attached, abrasive net to which abrasive grains are attached, coated abrasives in the nature of abrasive cloth to which abrasive grains are attached, flexible abrasives in the nature of abrasive cloth to which abrasive grains are attached, abrasive cloth to which abrasive grains are attached,] abrasive paper discs, [ abrasive paper belts,] abrasive paper wheels, abrasive rolls, abrasive sheets, and abrasive strips, all the aforesaid goods for grinding, sanding, polishing, cleaning and finishing wood, plastic, metal, painted and lacquered surfaces, and composites of the foregoing materials;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. Systems and methods for assembling microelectronic devices that have a base die and a conventional wire-bond die stacked on the base die. In one embodiment of a method in accordance with the invention, a base die is placed on a substrate and then a first stacked die is subsequently stacked on the base die. The first stacked die is stacked on the base die in a single pass through a die attach machine without first storing or otherwise processing the base die/substrate assembly in a separate machine. The stacked die, moreover, can be stacked onto the base die before heating the base die to reflow a solder or otherwise attach the base die to the substrate. After stacking the first stacked die on the base die, the complete die assembly can be heated to (a) secure the base die to the substrate, and (b) secure the first stacked die to the base die.