BIO BASE

Brand Owner (click to sort) Address Description
BIOBASE CLARIANT AG Rothausstrasse 61 Muttenz 4132 Switzerland BIO BASE;Emulsifiers, in particular containing glyceryl stearate, cetearyl alcohol, sodium stearoyl lactylate, tocopherol, lecithin, protein hydrolysates, or stearic acid; raw materials for cosmetic industries, in particular emulsifiers, in particular containing glyceryl stearate, cetearyl alcohol, sodium stearoyl lactylate, tocopherol, lecithin, protein hydrolysates, or stearic acid; chemicals used in the cosmetics industry, in particular intermediates containing emulsifiers; chemical preparations for use in the manufacture of cosmetics, in particular emulsifiers, in particular containing glyceryl stearate, cetearyl alcohol, sodium stearoyl lactylate, tocopherol, lecithin, protein hydrolysates, or stearic acid;
BIOBASE A. SCHULMAN, INC. 3637 Ridgewood Road Fairlawn OH 44321 BIO BASE;Polymer resins used in the manufacture of resin or fiber composites;
BIOBASE Omex Agrifluids, Inc. 1675 Dockery Ave SELMA CA 93662 BIO BASE;Fertilizers for agricultural use;
BIOBASE Innovasis, Inc. 614 E 3900 S SALT LAKE CITY UT 84107 BIO BASE;Providing a database in the field of spinal surgery featuring treatment and outcome data from surgical procedures performed on spinal patients;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. Systems and methods for assembling microelectronic devices that have a base die and a conventional wire-bond die stacked on the base die. In one embodiment of a method in accordance with the invention, a base die is placed on a substrate and then a first stacked die is subsequently stacked on the base die. The first stacked die is stacked on the base die in a single pass through a die attach machine without first storing or otherwise processing the base die/substrate assembly in a separate machine. The stacked die, moreover, can be stacked onto the base die before heating the base die to reflow a solder or otherwise attach the base die to the substrate. After stacking the first stacked die on the base die, the complete die assembly can be heated to (a) secure the base die to the substrate, and (b) secure the first stacked die to the base die.