BONDING CONSTRUCTION PROCESS BOATS

Brand	Owner	Address	Description
I.C.S.	FINELINE INDUSTRIES, INC.	455 GROGAN AVENUE Merced CA 95340	bonding construction process for boats;
	Where the owner name is not linked, that owner no longer owns the brand

Technical Examples

An interface assembly (20) and method for testing a semiconductor wafer prior to performing a flip chip bumping process are provided. The interface assembly includes a flip chip bonding pad (24) having a region (28) for performing the bumping process. A test pad (22) is integrally constructed with the bonding pad and includes a probe region (26) for performing wafer-level testing prior to performing the bumping process. The integral construction of the bonding and testing pads avoids, for example, an introduction of propagation delays to test signals passing therethrough, thereby improving the accuracy and reliability of wafer test results.