BUFFING POLISHING COMPOUNDS

Brand Owner (click to sort) Address Description
DELTA Delta International Machinery Corp. 4825 Highway 45 Jackson TN 38305 BUFFING AND POLISHING COMPOUNDS FOR METAL AND PLASTIC SURFACES; SANDPAPER; ABRASIVE PAPER;
RED LION DIVINE BROTHERS COMPANY 200 Seward Avenue Utica NY 13502 buffing and polishing compounds, namely, pastes, bars, greaseless materials, liquids for surfacing and coloring metal surfaces;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. A method for chemical mechanical polishing (CMP) wafers having high aspect ratio surface topography. A wafer is positioned on a plate. A polishing pad is coupled to a platen. A polishing solution (e.g., slurry) is added between the polishing pad and the wafer. CMP is performed on the wafer by creating a relative movement between the polishing pad and the wafer. The polishing pad removes substantially all residual material from the channels. To accomplish this, the polishing pad has a compressibility of at least 5% at a polishing pressure of about 4 psi.