BUILT WHAT AHEAD

Brand Owner Address Description
BUILT FOR WHAT'S AHEAD BRIGHTHOUSE SERVICES 11225 North Community House Road Charlotte NC 28277 BUILT FOR WHAT IS AHEAD;Insurance underwriting services for all types of insurance; insurance services, namely, underwriting, issuing and administration of life insurance; underwriting, issuance and administration of annuities; insurance brokerage services; investment services, namely, asset acquisition, consultation, development and management services; investment of funds for others; annuity services, namely, account and investment administration and the investment and distribution of annuity funds; financial services, namely, investment fund transfer and transaction services; financial services, namely, providing an investment option available for variable annuity and variable life insurance products; financial and investment services, namely, asset and investment acquisition, consultation, advisory and development; insurance and financial information and consultancy services;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. A semiconductor substrate, probe card, and methods for stressing and testing dies on a semiconductor substrate are provided. The semiconductor substrate, typically a semiconductor wafer, comprises dies disposed thereon and a redistribution layer (RDL) for routing signals from a test circuit into dies on the substrate that are not currently under probe. The RDL includes look-ahead contacts associated with a first die set that are electrically connected by traces to dies of a second die set. Upon contact of elements of the probe tester with the look-ahead contacts, required Vcc power, GND ground potential and signals from the probe tester are routed through the traces to the die of the die set not currently under probe. The dies can comprise a built-in self-stress (BISS) circuit and/or a built-in self-test (BIST) circuit for implementing a stress or test sequence. The look-ahead contacts allow for overlapping or substantially simultaneously stressing and/or testing dies of dies of a die set currently under probe and dies of a second die set located prior to or after the current probe head position (i.e., not under probe).