C BASE

Brand Owner (click to sort) Address Description
C-BASE TERRATS MEDICAL, S.L. c. Mogoda, 75-99 Pol. Ind. Can Salvatella Barberà Del Vallès 08210 Spain The trademark consists of the name C-BASE, where the letters C and B are represented in capital letters and the letters ASE are in lowercase. Between the letter C and the term BASE there is a blue hyphen. The letter C is represented in white and inserted into a blue rectangular geometric body in which the left side has three notches in the shape of a half circle. The right side of the geometric body has two notches in the shape of a half circle and between them the hypehn is inserted. The upper and lower parts of said geometric body are straight. The term BASE is represented in blue.;The color(s) blue and white is/are claimed as a feature of the mark.;Surgical instruments and apparatus for dental use; dental instruments and apparatus, namely, dental implants and dental prostheses and accessories specially adapted therefor, with said accessories being in the nature of dental clips for securing preexisting dentures, implant abutment screws, and dental screwdrivers; dental implant systems comprised of dental implants, dental prostheses, implant abutments, artificial teeth, and pins for artificial teeth; pins for artificial teeth; dentures and structural components therefor; dental implants of synthetic materials, namely, implant abutments; implant abutments for dental purposes; artificial teeth; suture materials for dental use;
C/BASE ECOUNT, INC. 555 North Lane, Suite 5040 Conshohocken PA 19428 C BASE;business management and consultation services in the field of customer acquisition and retention through the development of loyalty programs and the issuance of cards and membership in card programs, namely, multifunction cards, credit cards, discount cards, calling cards, loyalty cards, frequency cards, co-branded cards, affinity cards, stored value cards, membership cards and identification cards;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. Systems and methods for assembling microelectronic devices that have a base die and a conventional wire-bond die stacked on the base die. In one embodiment of a method in accordance with the invention, a base die is placed on a substrate and then a first stacked die is subsequently stacked on the base die. The first stacked die is stacked on the base die in a single pass through a die attach machine without first storing or otherwise processing the base die/substrate assembly in a separate machine. The stacked die, moreover, can be stacked onto the base die before heating the base die to reflow a solder or otherwise attach the base die to the substrate. After stacking the first stacked die on the base die, the complete die assembly can be heated to (a) secure the base die to the substrate, and (b) secure the first stacked die to the base die.