CARRIER ASSEMBLIES

Brand Owner (click to sort) Address Description
GEODYNAMICS GEODynamics, Inc. 10500 West I-20 Millsap TX 76066 Carrier assemblies, namely, perforating guns for use in oil and gas well drilling that employ energetic materials for the perforation, completion, repair, or abandonment of oil and gas wells and the cutting or abandonment of well tubulars, wellheads, and related production structures;GEO DYNAMICS;Energetic material, namely, shaped charges and linear explosive charges for the perforation, completion, repair, or abandonment of oil and gas wells and the cutting or abandonment of well tubulars, wellheads and related production structures;
HELLFIRE GEODynamics, Inc. 10500 West I-20 Millsap TX 76066 Carrier assemblies, namely, perforating guns for use in oil and gas well drilling that employ energetic materials for the perforation, completion, repair, or abandonment of oil and gas wells and the cutting or abandonment of well tubulars, wellheads, and related production structures;HELL FIRE;
UPSTAGE GEODynamics, Inc. 10500 West I-20 Millsap TX 76066 Carrier assemblies, namely, perforating guns for use in oil and gas well drilling that employ energetic materials for the perforation, completion, repair, or abandonment of oil and gas wells and the cutting or abandonment of well tubulars;UPSTAGE;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. A phased array antenna module for use in the gigahertz bandwidth. The module includes a metallic core with a pair of chip carrier assemblies secured to opposite sides of the core. The core has an internal waveguide with a signal splitter for directing electromagnetic wave energy evenly to the two chip carrier assemblies. A flexible, cylindrical connector assembly electrically couples the chip carrier assemblies to an aperture board. The aperture board includes a plurality of dipole antenna radiating elements. The module core is coupled directly to a cold plate. A direct thermal path is created between the chip carrier assemblies, the module core and the cold plate for highly efficient cooling of the electronic components on the chip carrier assemblies.