CHEMICAL COMPOSITION FOR REMOVAL

Brand Owner (click to sort) Address Description
603 SHIPLEY COMPANY INC. 2300 WASHINGTON ST. NEWTON MA 02162 CHEMICAL COMPOSITION FOR THE REMOVAL OF SOLDER FROM SURFACES, USED IN THE MANUFACTURER OF PRINTED CIRCUIT BOARDS;
SPRAY-KLEEN BOSTWICK LABORATORIES, INC. 4355 Innslake Drive Glen Allen VA 23060 CHEMICAL COMPOSITION FOR REMOVAL OF SPOTS FROM FABRICS;SPRAY-CLEAN;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. To provide a polishing composition whereby the stock removal rate of a silicon nitride layer is higher than the stock removal rate of a silicon oxide layer, there is substantially no adverse effect against polishing planarization, and a sufficient stock removal rate of a silicon nitride layer is obtainable, and a polishing method employing such a composition. A polishing composition which has silicon oxide abrasive grains, an acidic additive and water, wherein the acidic additive is such that when it is formed into a 85 wt % aqueous solution, the chemical etching rate of the silicon nitride layer is at most 0.1 nm/hr in an atmosphere of 80° C. Particularly preferred is one wherein the silicon oxide abrasive grains have an average particle size of from 1 to 50 nm, and the pH of the composition is from 3.5 to 6.5.