CHEMICAL PLATING SOLUTIONS

Brand Owner (click to sort) Address Description
TOP ELEUP OKUNO CHEMICAL INDUSTRIES CO., LTD. 7-10, Doshomachi 4-chome, Chuo-ku Osaka-shi, Osaka 541-0045 Japan Chemical plating solutions, namely, chromium plating compositions, metal plating chemical compositions and electrolytic acid copper solutions; industrial chemicals;
TOP TRIPASSIVE OKUNO CHEMICAL INDUSTRIES CO., LTD. 7-10, Doshomachi 4-chome, Chuo-ku Osaka-shi, Osaka 541-0045 Japan Chemical plating solutions, namely, chromium plating compositions, metal plating chemical compositions and electrolytic acid copper solutions; industrial chemicals;
UBAC MACDERMID ENTHONE INC. 350 FRONTAGE ROAD WEST HAVEN CT 06516 CHEMICAL PLATING SOLUTIONS, AND ADDITION AGENTS THEREFOR, FOR USE IN THE ELECTRODEPOSITION OF COPPER;U BACK;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. Embodiments of the invention provide an analytical method and analytical reagent solutions for determining the concentration of electrolyte components, such as copper, acid and chloride constituents in an acid or basic metal plating bath using a chemical analyzer. Common methods for measuring the concentration of copper general require two reagent solutions/two steps. This invention provides a novel analytical reagent solution that simplifies the chelating, buffering, and cleaning functions of separate regent solutions required for measuring electrolyte concentration. This has the benefits of reducing chemical inventory and associated dispensing equipment, and thus reducing chemical consumption.