CLEANING POLISHING

Brand	Owner (click to sort)	Address	Description
INTER CHANGE	Scot Young Research Limited	Lye By Pass Lye, Stourbridge West Midlands DY98HG United Kingdom	[ cleaning polishing, scouring and abrasive preparations and substances; soaps, detergents, all not for use on the person ];instruments and materials for cleaning purposes, namely buckets, buckets incorporating mop wringers and buckets incorporating castors; bottles for cleaning solutions, bottles incorporating spraying apparatus (not being machines); dustbins, refuse bins, wastepaper bins; dusters, mops, mop heads, mop holders; squeegees and wipers for cleaning windows and floors; scouring pads, scrubbing brushes; litter and waste scoops; sponge mop heads, sponge holders and sponge wringers; heavy duty handles designed for attachment to mop heads, duster heads, scraper heads, scrubbing brush heads, brush heads, broom heads, sweeper heads, sponges and sponge mop heads;
ZEE-GLAZE	ZIEBART INTERNATIONAL CORPORATION	1290 E. Maple Rd. Troy MI 48083	CLEANING AND POLISHING, AS BY GLAZING, AUTOMOTIVE VEHICLE SURFACES;Z GLAZE;PROTECTIVE COATINGS IN THE NATURE OF A POLISH OR GLAZE FOR AUTOMOTIVE SURFACES;
	Where the owner name is not linked, that owner no longer owns the brand

Technical Examples

A polishing pad is cleaned of Cu CMP by-products, subsequent to planarizing a wafer, to reduce pad-glazing by applying to the polishing pad surface a composition comprising about 0.1 to about 3.0 wt. % of at least one organic compound having one or more amine or amide groups, an acid or a base in an amount sufficient to adjust the pH of the composition to about 5.0 to about 12.0, the remainder water. Embodiments comprise ex situ cleaning of a rotating polishing pad by applying a solution having a pH of about 5.0 to about 12.0 at a flow rate of about 100 to about 600 ml/min. for about 3 to about 20 seconds after polishing a wafer having a Cu-containing surface and then removing the cleaning solution from the polishing pad by high pressure rinsing with water.