CLEANING POLISHING MACHINES FOR

Brand	Owner	Address	Description
PHOENIX	Swiss Clean, Inc.	3650 44th Street SE Grand Rapids MI 49512	Cleaning and Polishing Machines for Industrial, Commercial and Institutional Usage-Namely, Vacuum Cleaners, Mopping Machines, Sweeping Machines, Carpet Shampooing Machines, Machines for Extracting Dirt from Carpet;Preparations for Industrial, Commercial and Institutional Cleaning-Namely, Floor Cleaner and Stripper Preparations, Floor Polish, General Purpose Cleaning Detergents, Floor Finishes, Floor Buffing and Cleaning Compounds and Degreasers; Preparations for Treating Dust Mops for Dust Mopping, Preparations for Treating Dust Cloths for Hand Dusting; Germicidal and Disinfectant Cleaners;Mops, Brooms, Dust Mops and Cleaning and Buffing Pads;
	Where the owner name is not linked, that owner no longer owns the brand

Technical Examples

A polishing pad is cleaned of Cu CMP by-products, subsequent to planarizing a wafer, to reduce pad-glazing by applying to the polishing pad surface a composition comprising about 0.1 to about 3.0 wt. % of at least one organic compound having one or more amine or amide groups, an acid or a base in an amount sufficient to adjust the pH of the composition to about 5.0 to about 12.0, the remainder water. Embodiments comprise ex situ cleaning of a rotating polishing pad by applying a solution having a pH of about 5.0 to about 12.0 at a flow rate of about 100 to about 600 ml/min. for about 3 to about 20 seconds after polishing a wafer having a Cu-containing surface and then removing the cleaning solution from the polishing pad by high pressure rinsing with water.