COMPOUNDS CLEANING

Brand Owner (click to sort) Address Description
GORILLA CLEAN HOMELAND VINYL PRODUCTS, INC. 3300 Pinson Valley Parkway Birmingham AL 35217 Compounds for cleaning, conditioning, restoring and protecting outdoor nonmetallic building products, specifically vinyl/PVC and related products. Expressly excluding goods/services in the automotive field, including use on vehicles, motorcycles, scooters, trailers or ATV's;CLEAN;
GORILLA NU HOMELAND VINYL PRODUCTS, INC. 3300 Pinson Valley Parkway Birmingham AL 35217 Compounds for cleaning, conditioning, restoring and protecting outdoor non-metallic surfaces, specifically PVC. Expressly excluding goods/services in the automotive field, including use on vehicles, motorcycles, scooters, trailers or ATV's. Expressly excluding adhesives;NU;
THE MATCHLESS METAL POLISH COMPANY The Matchless Metal Polish Company 840 West 49th Place Chicago IL 60609 Compounds for cleaning, buffing and polishing metals, marble, rubber, celluloid, wood, plastic and glass;MATCHLESS METAL has become distinctive of the goods/services through the applicant's substantially exclusive and continuous use of the mark in commerce that the U.S. Congress may lawfully regulate for at least the five years immediately before the date of this statement.;THE AND POLISH COMPANY;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. A post-etch residue cleaning composition for cleaning ashed or unashed aluminum/SiN/Si post-etch residue from small dimensions on semiconductor substrates. The cleaning composition contains supercritical CO2 (SCCO2), alcohol, fluoride source, an aluminum ion complexing agent and, optionally, corrosion inhibitor. Such cleaning composition overcomes the intrinsic deficiency of SCCO2 as a cleaning reagent, viz., the non-polar character of SCCO2 and its associated inability to solubilize species such as inorganic salts and polar organic compounds that are present in the post-etch residue and that must be removed from the semiconductor substrate for efficient cleaning. The cleaning composition enables damage-free, residue-free cleaning of substrates having ashed or unashed aluminum/SiN/Si post-etch residue thereon.