COMPUTER INTEGRATED CIRCUITS

Brand Owner (click to sort) Address Description
3G-RAM ATMOS CORPORATION Carrollton TX COMPUTER INTEGRATED CIRCUITS;3G RAM;
AMERICAN MEGATRENDS American Megatrends, Inc. 5555 Oakbrook Parkway, Building 200 Norcross GA 30093 computer integrated circuits; computer software for interfacing and testing computer compatible hardware;custom design of computer hardware and software to the specification of others;
AMERICAN MEGATRENDS AMERICAN MEGATRENDS INTERNATIONAL Suite 425 3095 Satellite Boulevard, Building 800 Duluth GA 30096 computer integrated circuits; computer software for interfacing and testing computer compatible hardware;as to AMERICAN;custom design services, namely custom design of computer hardware and software to the specification of others;
DIAL A DRAM ATMOS CORPORATION Carrollton TX COMPUTER INTEGRATED CIRCUITS;
EMBDRAM ATMOS CORPORATION Carrollton TX COMPUTER INTEGRATED CIRCUITS;
PRIDE American Megatrends, Inc. 5555 Oakbrook Parkway, Building 200 Norcross GA 30093 computer integrated circuits; computer software for interfacing and testing computer compatible hardware;
PRIDE PERFORMANCE RICH IDE American Megatrends, Inc. 5555 Oakbrook Parkway, Building 200 Norcross GA 30093 computer integrated circuits; computer software for interfacing and testing computer compatible hardware;PERFORMANCE and IDE;
SOCONNECT ATMOS CORPORATION Carrollton TX COMPUTER INTEGRATED CIRCUITS;SO CONNECT;
SOCRAM ATMOS CORPORATION Carrollton TX COMPUTER INTEGRATED CIRCUITS;
TESTCONNECT ATMOS CORPORATION Carrollton TX COMPUTER INTEGRATED CIRCUITS;TEST CONNECT;
YOZAN YOZAN, INC. 2-22-2 KOISHIKAWA, BUNKYO-KU TOKYO 112 Japan COMPUTER AND INTEGRATED CIRCUITS AND LARGE SCALE INTEGRATION MODULES FOR USE THEREIN; COMPUTER UTILITY SOFTWARE SOLD THEREWITH, FACTORY AUTOMATION SYSTEMS COMPRISING COMPUTERS, COMPUTER PERIPHERALS AND COMPUTER PROGRAM;
YOZAN YOZAN, INC. 2-22-2 KOISHIKAWA, BUNKYO-KU TOKYO 112 Japan COMPUTER AND INTEGRATED CIRCUITS AND LARGE SCALE INTEGRATION MODULES FOR USE THEREIN; COMPUTER UTILITY SOFTWARE SOLD THEREWITH, FACTORY AUTOMATION SYSTEMS COMPRISING COMOPUTERS, COMPUTER PERIPHERALS AND COMPUTER PROGRAM;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. The invention provides a sealing layer that seals metal bonding structures between three dimensional bonded integrated circuits from a surrounding environment. A material may be applied to fill a volume between the bonded integrated circuits or seal the perimeter of the volume between the bonded integrated circuits. The material may be the same material as that used for underfilling the volume between the bottom integrated circuit and a substrate.