CONNECTORS FOR CONNECTING LEADLESS CHIP

Brand	Owner	Address	Description
MOE	TYCO ELECTRONICS SERVICES GMBH	Rheinstrasse 20 CH-8200 Schaffhausen Switzerland	Connectors for Connecting Leadless Chip Carriers to Printed Circuit Boards, Ceramic Devices or Other Substrates;
	Where the owner name is not linked, that owner no longer owns the brand

Technical Examples

A method for fabricating leadless packages with mold locking characteristics is disclosed. A provided leadless leadframe has a plurality of units in a matrix, each unit includes an improved die pad with a plurality of indentations, such as semi-vias in the sidewall thereof and a plurality of leads around the die pad. After chip attachment and electrical connection, a plurality of package bodies for semiconductor packages are individually formed on the corresponding units and covered the indentations in order to enhance the horizontal mold locking capability of the die pad. Using punching, connecting bars of the leadless leadframe are removed to isolate the leadless packages.