FindOwnerSearch
Brands and Their Owners
| Brand | Owner (click to sort) | Address | Description |
|---|---|---|---|
| ALVABLOCK | ALVANON HK, LTD. | 2937 KWAI WING ROAD SING MEI INDUSTRIAL BUILDING 10\\F KWAI CHUNG KOWLOON Hong Kong | consulting for others in the field of clothing and apparel, namely, design pattern consulting for the fashion and apparel industry; |
| INNOVATION ECHO | NATIONAL INVENTORS HALL OF FAME, INC. | 3701 Highland Park NW North Canton OH 44720 | Consulting to others in the fields of energy conservation, natural resource conservation, overpopulation, pollution and climate change;Research related to energy conservation, natural resource conservation, overpopulation, pollution and climate change; |
| KNOWLEDGE MAPPING | NIIT (USA), INC. | 1050 CROWNE POINTE PARKWAY, SUITE 900 ATLANTA GA 30338 | consulting for others in the field of employee training; |
| LEARNINGBOARD | Curtis, James G. | c/o Natter & Natter, 501 Fifth Avenue New York NY 10017 | Consulting for others in the field of education;LEARNING BOARD; |
| PUEBLO CONSULTING INC. | Pueblo Consulting, Inc. | #258 1131 Lake Street Oak Park IL 60606 | Consulting for others in the fields of business plans, management assessment, strategic planning, management development, sales expansion, cash flow analysis, operations, marketing plans, access to capital; part time chief financial officer services, namely, assistance in management of business activities;The English translation of the word pueblo in the mark is town.;CONSULTING INC.; |
| TRISOURCE | TriLogic, Inc. | 2825 Eastlake East, Suite 100 Seattle WA 98102 | consulting for others in the field of computer software; |
| UNOVIS | UNIVERSAL INSTRUMENTS CORPORATION | 33 Broome Corporate Parkway Conklin NY 13748 | Consulting for others in the field of electronics assembly and processes for assembling semiconductor components; providing information to others in the field of electronics and semiconductor component assembly related to flip chip and die bonding, hybrid module assembly, and mechanical assembly;The mark consists of a striped pyramid with a shadow situated to the left of the word UNOVIS. The word UNOVIS appears to be cut in half and partially separated top and bottom.;Electrical controllers and computer software for use in controlling electronics and semiconductor component assembly machines, all for use by customers in the automotive, component assembly, telecommunications, and medical markets; computer software for determining optimum processes for assembling electronics and semiconductor components, for use by customers in the automotive, component assembly, telecommunications, and medical markets; computer based apparatus for designing the layout of electronic circuits; electrical controllers and computer software for use in controlling semiconductor manufacturing machines that perform flip chip and die bonding, hybrid module assembly, and mechanical assembly utilizing surface mount and insertion mount equipment;Electronics assembly machines that complement and enhance standard surface mount equipment for the automotive, component assembly, telecommunications, and medical markets, namely, semiconductor manufacturing machines, component and printed circuit board assembly machines in the nature of manufacturing machines for performing one or more of the following functions, namely, orienting, feeding, mounting and bonding electronic semiconductor components together and onto printed circuit boards, semiconductor wafer processing machines and semiconductor substrates manufacturing machines; semiconductor manufacturing machines featuring component and die feeders, conveyors, process peripherals and flexible process cells; semiconductor manufacturing machines for use in flip chip and die bonding, hybrid module assembly, and mechanical assembly utilizing surface mount and insertion mount equipment;Color is not claimed as a feature of the mark.;The wording UNOVIS has no meaning in a foreign language.;Research and development in the field of surface mount and insertion mount electronics assembly equipment; engineering services in the field of electronics assembly equipment for customers in the automotive, semiconductor component assembly, telecommunications, and medical markets; design, development and testing of new products for others in the field of electronics assembly equipment; |
| UNOVIS | UNIVERSAL INSTRUMENTS CORPORATION | 33 Broome Corporate Parkway Conklin NY 13748 | Consulting for others in the field of electronics assembly and processes for assembling semiconductor components; providing information to others in the field of electronics and semiconductor component assembly related to flip chip and die bonding, hybrid module assembly, and mechanical assembly;Electrical controllers and computer software for use in controlling electronics and semiconductor component assembly machines, all for use by customers in the automotive, component assembly, telecommunications, and medical markets; computer software for determining optimum processes for assembling electronics and semiconductor components, for use by customers in the automotive, component assembly, telecommunications, and medical markets; computer based apparatus for designing the layout of electronic circuits; electrical controllers and computer software for use in controlling semiconductor manufacturing machines that perform flip chip and die bonding, hybrid module assembly, and mechanical assembly utilizing surface mount and insertion mount equipment;Electronics assembly machines that complement and enhance standard surface mount equipment for the automotive, component assembly, telecommunications, and medical markets, namely, semiconductor manufacturing machines, component and printed circuit board assembly machines in the nature of manufacturing machines for performing one or more of the following functions, namely, orienting, feeding, mounting and bonding electronic semiconductor components together and onto printed circuit boards, semiconductor wafer processing machines and semiconductor substrates manufacturing machines; semiconductor manufacturing machines featuring component and die feeders, conveyors, process peripherals and flexible process cells; semiconductor manufacturing machines for use in flip chip and die bonding, hybrid module assembly, and mechanical assembly utilizing surface mount and insertion mount equipment;Research and development in the field of surface mount and insertion mount electronics assembly equipment; engineering services in the field of electronics assembly equipment for customers in the automotive, semiconductor component assembly, telecommunications, and medical markets; design, development and testing of new products for others in the field of electronics assembly equipment; |
| UNOVIS SOLUTIONS | UNIVERSAL INSTRUMENTS CORPORATION | 33 Broome Corporate Parkway Conklin NY 13748 | Consulting for others in the field of electronics assembly and processes for assembling semiconductor components; providing information to others in the field of electronics and semiconductor component assembly related to flip chip and die bonding, hybrid module assembly, and mechanical assembly;SOLUTIONS;Research and development in the field of surface mount and insertion mount electronics assembly equipment; engineering services in the field of electronics assembly equipment for customers in the automotive, semiconductor component assembly, telecommunications, and medical markets; design, development and testing of new products for others in the field of electronics assembly equipment; |
Where the owner name is not linked, that owner no longer owns the brand |