COPPER CLAD ALUMINUM WIRE

Brand Owner Address Description
SHIPPED ON TIME WITH SAFETY IN MIND COPPERWELD CORPORATION 2105 FOUR GATEWAY CENTER PITTSBURGH PA 152221211 copper-clad aluminum wire, copper-clad steel wire and copper-clad steel strand;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. The present invention is an electronic interconnect comprising a bond pad consisting essentially of aluminum and copper and configured for use in semiconductor electronic devices to couple a bond wire to an integrated circuit package. The bond pad has an oxide coating residing on at least a topmost surface of the bond pad. The oxide coating consists essentially of aluminum, copper, and oxygen. Therefore, the bond pad has little, if any, naturally occurring corrosion products such as hydrated aluminum hydroxide (Al(OH)3) and/or Al2Cu particles. Al(OH)3 films and Al2Cu particles have been shown to form on aluminum copper bond pads, preventing effective wire-bonding.