COPPER PHOS

Brand Owner Address Description
CU-PHOS UNIVERTICAL CORPORATION 14841 MEYERS ROAD DETROIT MI 48227 COPPER-PHOS;COPPER ALLOY ANODES FOR USE IN COPPER PLATING;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. An improved copper ECD process. After the copper seed layer (116) is formed, a first portion of copper film (118) is plated onto the surface of the seed layer (116). The surface of the first portion of the copper film (118) is then rinsed to equalize the organic adsorption on all sites to prevent preferential copper growth in dense areas. After rinsing, the remaining copper of the copper film (118) is electrochemically deposited.