COPPER SHEET

Brand Owner (click to sort) Address Description
OF-OK LUVATA OY KUPARITIE 5 PORI 28330 Finland copper in sheet, rod, [ bar and/or ] billet form; wire; metal tubing [ ; metal pipes and fittings therefor and metal castings ];OF OK;
OFE-OK LUVATA OY KUPARITIE 5 PORI 28330 Finland copper in sheet, rod, bar and/or billet form; wire; metal tubing; metal pipes and fittings therefor and metal castings;OFE OK;
OFE-OK MMC COPPER PRODUCTS OY KUPARITIE 5 PORI FI-28330 Finland copper in sheet, rod, bar and/or billet form; wire; metal tubing; metal pipes and fittings therefor and metal castings;OFE OK;
TE-OK LUVATA ESPOO OY P.O. BOX 78 ESPOO FI-02101 Finland [ copper in sheet, ] rod, [ bar and/or ] billet form; wire [ ; metal tubing; metal pipes and fittings therefor and metal castings ];TE OK;
TE-OK OUTOKUMPU COPPER PRODUCTS OY RIIHITONTUNTIE 7A ESPOO 02200 Finland [ copper in sheet, ] rod, [ bar and/or ] billet form; wire [ ; metal tubing; metal pipes and fittings therefor and metal castings ];TE OK;
TE-OK Outokumpu Copper Oy Riihitontuntie 7D 02200 Espoo Finland [ copper in sheet, ] rod, [ bar and/or ] billet form; wire [ ; metal tubing; metal pipes and fittings therefor and metal castings ];TE OK;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. An improved copper ECD process. After the copper seed layer (116) is formed, a first portion of copper film (118) is plated onto the surface of the seed layer (116). The surface of the first portion of the copper film (118) is then rinsed to equalize the organic adsorption on all sites to prevent preferential copper growth in dense areas. After rinsing, the remaining copper of the copper film (118) is electrochemically deposited.