COPPER BASE ALLOYS

Brand Owner (click to sort) Address Description
ALCOLOY OLIN CORPORATION 190 Carondelet Plaza, Suite 1530 St. Louis MO 63105 COPPER BASE ALLOYS;
COBRAZE OLIN CORPORATION 190 Carondelet Plaza, Suite 1530 St. Louis MO 63105 COPPER BASE ALLOYS;
CORONZE OLIN MATHIESON CHEMICAL CORPORATION 745 FIFTH AVE. NEW YORK NY COPPER BASE ALLOYS;
ELBRODUR KME SPECIAL PRODUCTS GMBH & CO. KG. STEPHANSTRAßE 3 C/O JOST RECHTSANWÄLTE 60313 FRANKFURT AM MAIN Germany COPPER BASE ALLOYS IN THE FORM OF SEMI-FABRICATED FORGINGS, RODS, BARS, PLATES, SHEETS, STRIPS, WIRE, TUBES AND THE LIKE, IN PARTICULAR FOR USE IN THE FABRICATION OF WELDING MATERIALS AND ELECTRICAL CONTACTS;
ELBRODUR KME SPECIAL PRODUCTS GMBH KLOSTERSTRASSE 29 OSNABRÜCK 49074 Germany COPPER BASE ALLOYS IN THE FORM OF SEMI-FABRICATED FORGINGS, RODS, BARS, PLATES, SHEETS, STRIPS, WIRE, TUBES AND THE LIKE, IN PARTICULAR FOR USE IN THE FABRICATION OF WELDING MATERIALS AND ELECTRICAL CONTACTS;
ELBRODUR KABEL-UND METALLWERKE GUTEHOFFNUNGSHUTTE,AG KLOSTERSTRASSE 29 D-4500 OSNABRUCK Germany COPPER BASE ALLOYS IN THE FORM OF SEMI-FABRICATED FORGINGS, RODS, BARS, PLATES, SHEETS, STRIPS, WIRE, TUBES AND THE LIKE, IN PARTICULAR FOR USE IN THE FABRICATION OF WELDING MATERIALS AND ELECTRICAL CONTACTS;
ELBRODUR OSNABRUCKER KUPFER- UND DRAHTWERK WESTDEUTSCHLAND OSNABRUCK 23 Germany COPPER BASE ALLOYS IN THE FORM OF SEMI-FABRICATED FORGINGS, RODS, BARS, PLATES, SHEETS, STRIPS, WIRE, TUBES AND THE LIKE, IN PARTICULAR FOR USE IN THE FABRICATION OF WELDING MATERIALS AND ELECTRICAL CONTACTS;
HSM OLIN CORPORATION 190 Carondelet Plaza, Suite 1530 St. Louis MO 63105 COPPER BASE ALLOYS;
 

Where the owner name is not linked, that owner no longer owns the brand

   
Technical Examples
  1. The surface treatment agent for copper and copper alloys contains hydrogen peroxide, a mineral acid, an azole compound, silver ion and a halide ion. The surface treatment agent for copper and copper alloys is useful in the production of printed wiring boards in electronics industry. The surface treatment agent roughens the surface of copper and copper alloys. Particularly, the surface treatment agent can form a uniform and undulation-free roughened surface on copper-clad substrates having plated mirror surface, this having been difficult in conventional techniques, thereby significantly improving the adhesion to etching resists, solder resists, in addition, to prepregs and a resin for mounting electronic parts.