CORE BOND

Brand Owner (click to sort) Address Description
CORBOND Corbond Corporation 32404 East Frontage Road Bozeman MT 59715 CORE BOND;Sample distribution; business advice and information; advice concerning the marketing of insulating materials; customer service in the fields of building construction, sealing, and insulating;
CORBOND Corbond Corporation 32404 East Frontage Road Bozeman MT 59715 CORE BOND;Clothing; namley, shirts, hats, sweatshirts, golf shirts, dress shirts, jackets, and vests;
COREBOND CUMULUS FIBRES, INC. P.O. BOX 668244 1101 TAR HEEL RD. CHARLOTTE NC 28208 CORE BOND;MATTRESSES, UPHOLSTERED FURNITURE CUSHIONS AND OUTDOOR FURNITURE CUSHIONS MADE OF POLYESTER FIBER;
COREBOND INVISTA NORTH AMERICA S.A.R.L. 2801 Centerville Road Wilmington DE 19808 CORE BOND;MAN-MADE FIBERS FOR USE IN BEDDING AND HOME FURNISHING PRODUCTS;
COREBOND TAEKWANG FINE CHEMICAL CO., LTD. 130-18, Gado-ro, Gunsan-si Jeollabuk-do Republic of Korea CORE BOND;Color is not claimed as a feature of the mark.;Cement for pneumatic tires;
COREBOND BlueRidge Armor 1495 Highway 74a Bypass, Suite 150-192 Spindale NC 07932 CORE BOND;adhesive-backed vinyl labels; adhesive-backed plastic strips with hook and loop backing for affixing labels, images, or placards;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. A printed circuit board and a method for fabricating the same is provided. A substrate having a core layer and a plurality of pairs of bond pads thereon is prepared with at least one opening formed on the core layer between each pair of the bond pads. A solder mask layer covers the core layer and fills the openings, with recessed portions formed at positions of the solder mask layer on the openings during curing of the solder mask layer. When a small passive component is mounted on the printed circuit board, a space is formed between the bottom of the passive component and the recessed portions of the solder mask layer. An encapsulating resin can flow into the space to form an insulating barrier between the bond pads to prevent bridging between the bond pads and short circuiting of the passive component.