CUSTOM MOLDING PLASTIC COMPONENTS

Brand Owner (click to sort) Address Description
MC McKECHNIE PLC Walsall West Midlands W59 8D5 United Kingdom custom molding of plastic components for others;
MC MCKECHNIE McKECHNIE PLC Walsall West Midlands W59 8D5 United Kingdom custom molding of plastic components for others;
MCKECHNIE McKECHNIE PLC Walsall West Midlands W59 8D5 United Kingdom custom molding of plastic components for others;
MCKECHNIE PLASTIC COMPONENTS McKECHNIE PLC Walsall West Midlands W59 8D5 United Kingdom custom molding of plastic components for others;PLASTIC COMPONENTS;
S SHAPE, INC. BIDDLEFORD INDUSTRIAL PARK BIDDEFORD ME 04005 custom molding of plastic components for others;blank audio, video and magnetic computer tapes; plastic containers, namely, for holding audio tapes, video tapes, magnetic computer tapes and fax and modem telephone cords; computer memory cards and blank computer discs;
S SHAPE, INC. BIDDLEFORD INDUSTRIAL PARK BIDDEFORD ME 04005 custom molding of plastic components for others;S;
S SHAPE SHAPING GLOBAL TECHNOLOGY SHAPE, INC. BIDDLEFORD INDUSTRIAL PARK BIDDEFORD ME 04005 custom molding of plastic components for others;blank audio, video and magnetic computer tapes; plastic containers, namely, for holding audio tapes, video tapes, magnetic computer tapes and fax and modem telephone cords; computer memory cards and blank computer discs;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. The electronic component has a semiconductor chip embedded in a plastic compound. The electronic component is produced by first producing a number of electronic components on a panel and subsequent dicing into single electronic components. The semiconductor chip of this component is disposed on a substrate which includes or is entirely formed of plastic and is embedded in a plastic package molding compound. The plastic of the substrate has a glass transition temperature range which is lower than the glass transition temperature range of the plastic package molding compound.