CUSTOM MANUFACTURE HEAT DISSIPATION

Brand Owner (click to sort) Address Description
HEATSCAPE Heatscape.com, Inc. 318 Digital Drive Morgan Hill DE 95037 Custom manufacture of heat dissipation components, heat dissipation assemblies, heat dissipation systems, sheet metal enclosures for electronics, and plastic parts used in electronic enclosures, for others;Thermal management solutions for electronics, namely, heat dissipation components in the nature of CPU fans and computer heat sinks, PCB assemblies with heatsinks, heat dissipation assemblies comprising CPU fans and computer heat sinks, PCB assemblies with heatsinks, and heat dissipation systems comprising CPU fans and computer heat sinks; PCB assemblies with heatsinks; heat sinks, heatpipes, vapor chambers, all for electronics;HEAT SCAPE; HEAT ESCAPE;Engineering services, namely, design, testing and analysis of heat dissipation components, heat dissipation assemblies, and heat dissipation systems;
HEATSCAPE·COM Heatscape.com, Inc. 318 Digital Drive Morgan Hill DE 95037 Custom manufacture of heat dissipation components, heat dissipation assemblies, heat dissipation systems, sheet metal enclosures for electronics, and plastic parts used in electronic enclosures, for others;The mark consists of the words heatscape and com in blue with a red dot between the words and a red swirl design extending from the red dot below into the word heat.;Thermal management solutions for electronics, namely, heat dissipation components in the nature of CPU fans and computer heat sinks, PCB assemblies with heatsinks, heat dissipation assemblies comprising CPU fans and computer heat sinks, PCB assemblies with heatsinks, and heat dissipation systems comprising CPU fans and computer heat sinks; PCB assemblies with heatsinks; heat sinks, heatpipes, vapor chambers, all for electronics;HEATSCAPE DOT COM;The color(s) blue and red is/are claimed as a feature of the mark.;Engineering services, namely, design, testing and analysis of heat dissipation components, heat dissipation assemblies, and heat dissipation systems;
HEXFIN Robinson Fin Machines, Inc. 13670 Hwy 68 S Kenton OH 43326 CUSTOM MANUFACTURE OF HEAT DISSIPATION COMPONENTS, HEAT DISSIPATION ASSEMBLIES, AND HEAT DISSIPATION SYSTEMS FOR OTHERS;HEAT DISSIPATION COMPONENTS FOR COMPUTERS AND ELECTRONICS, NAMELY, HEAT SINKS FOR USE WITH MICROPROCESSORS, INTEGRATED CIRCUITS, AND APPLICATION-SPECIFIC INTEGRATED CIRCUITS (ASICS);ENGINEERING SERVICES NAMELY, DESIGN AND ANALYSIS OF HEAT DISSIPATION COMPONENTS, HEAT DISSIPATION ASSEMBLIES AND HEAT DISSIPATION SYSTEMS FOR OTHERS;
WAKEFIELD ENGINEERING WAKEFIELD THERMAL SOLUTIONS, INC. 33 BRIDGE STREET PELHAM NH 03076 custom manufacture of heat dissipation components, heat dissipation assemblies, and heat dissipation systems for others;thermal management solutions for electronics, namely, heat dissipation components and heat dissipation assemblies;as to WAKEFIELD;ENGINEERING;engineering services, namely, design and analysis of heat dissipation components, heat dissipation assemblies, and heat dissipation systems for others;
WE WAKEFIELD THERMAL SOLUTIONS, INC. 33 BRIDGE STREET PELHAM NH 03076 custom manufacture of heat dissipation components, heat dissipation assemblies, and heat dissipation systems for others;thermal management solutions for electronics, namely, heat dissipation components [ , systems ] and * heat dissipation * assemblies [ , and thermal design, analysis, manufacture and fabrication ];In the statement, Column 1, lines 8 through 10, and thermal design, analysis, manufacture and fabrication should be deleted, and Heat Dissipation should be inserted.;WE; WAKEFIELD ENGINEERING;engineering services, namely, design and analysis of heat dissipation components, heat dissipation assemblies, and heat dissipation systems for others;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. An IC package with an implanted heat-dissipation fin is introduced. The IC package provides a plastic package to seal an IC chip. One end of the heat-dissipation fin is implanted inside the plastic package, and another end is left outsides for directly heat-exchanging with a surrounding heat-transfer media. By providing the implanted heat-dissipation fin, a more efficient and broader heat-dissipation path for the IC package can be established so that the total heat dissipation of the IC package can be enhanced.