CUTTING BY ABRASION

Brand Owner Address Description
THERMOTRONIC THERMOCOMPACT 181 route des Sarves F-74370 EPAGNY METZ-TESSY France Cutting by abrasion; cutting of semiconductor wafers or ceramic materials or sapphires by abrasion; cutting of metals by abrasion; cutting of semiconductor wafers or ceramic materials or sapphires by means of abrasive wires;Cutting machines for processing semiconductor wafers; abrasive wires being parts of machines; abrasive wires for semiconductor wafer cutting being parts of machines; abrasive wires for cutting ceramic materials being parts of machines; abrasive wires for cutting sapphire being parts of machines; semiconductor cutting machines;Wire of metal; steel wires; abrasive wires of metal;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. A pair of gardening shears include a first handle, a first cutting member, a second cutting member, and a second handle. Thus, when the second cutting member is movable toward the first cutting member to perform the cutting action, the linking rod of the second cutting member pushes the first cutting member to drive the first cutting member to pivot about the drive arm of the mounting seat to push the first blade of the first cutting member downward, so that the first blade of the first cutting member is further movable toward the second blade of the second cutting member so as to enhance the cutting force of the first cutting member and the second cutting member thereby enhancing the working efficiency of the gardening shears.