DRY SEMICONDUCTOR PROCESSING EQUIPMENT

Brand Owner (click to sort) Address Description
MONARCH PRIMAXX, INC. 7377 William Avenue #800 Allentown PA 18106 Dry semiconductor processing equipment, namely, etching machines and semiconductor wafer processing equipment;
PRIMAXX PRIMAXX, INC. 7377 William Avenue #800 Allentown PA 18106 dry semiconductor processing equipment, namely gas-phase wafer cleaning modules;
PRIMAXX2 SUBMICRON SYSTEMS, INC. 6330 Hedgewood Drive Suite 150 Allentown PA 18106 dry semiconductor processing equipment, namely plasma-assisted downstream photo-chemical etchers;
UETCH PRIMAXX, INC. 7377 William Avenue #800 Allentown PA 18106 dry semiconductor processing equipment, namely, plasma etching machines, semiconductor wafer processing equipment, single-wafer etching machines;
UETCHER PRIMAXX, INC. 7377 William Avenue #800 Allentown PA 18106 dry semiconductor processing equipment, namely, plasma etching machines, semiconductor wafer processing equipment, single-wafer etching machines;
ULTIMAXX SUBMICRON SYSTEMS, INC. 6330 Hedgewood Drive Suite 150 Allentown PA 18106 dry semiconductor processing equipment, namely downstream microwave/photo-chemical cluster strip systems, comprising vacuum transfer robots and vacuum cassette elevator modules, gas-phase cleaning modules, and downstream microwave photo-resist strip modules;
VORTEX-CVD PRIMAXX, INC. 7377 William Avenue #800 Allentown PA 18106 dry semiconductor processing equipment, namely chemical vapor disposition modules;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. A method, system, and program storage device for implementing the method of controlling a manufacturing system, wherein the method comprises providing a plurality of workpieces to be processed on a processing tool, the plurality of workpieces located at processing stations prior to the processing tool, determining auxiliary equipment allocation needs for the processing tool based on characteristics associated with the plurality of workpieces prior to the workpieces arriving at the processing tool, and sending auxiliary equipment to the processing tool based on the allocation needs prior to the workpieces arriving at the processing tool. According to an embodiment of the invention, the processing tool comprises a photolithographic system, the auxiliary equipment comprises a reticle, and the plurality of workpieces comprise semiconductor substrates.