ELECTRICAL TESTING INSTRUMENTS

Brand Owner (click to sort) Address Description
D SNA Holdings Inc. 800 Federal Street Andover MA 01810 ELECTRICAL TESTING INSTRUMENTS, AND MORE PARTICULARLY FOR VOLTAGE-TESTING DEVICES;
ETI, (14259) ELECTRICAL TESTING INSTRUMENTS LIMITED 77 PROGRESS AVE. SCARBOROUGH, ONT.M1P2Y7 Canada ELECTRICAL TESTING INSTRUMENTS, NAMELY RELAY TEST SETS, RELAY TEST BENCHES, HIGH CURRENT TEST SETS, PORTABLE HIGH VOLTAGE CONTROLS, LABORATORY STYLE HIGH VOLTAGE CONTROLS, HIGH VOLTAGE D.C. TESTSETS, HIGH VOLTAGE DIELECTRIC STRENGTH TESTERS, OIL TESTERS, INSULATION RESISTANCE TESTERS, LOAD AND BOX, LIGHTNING ARRESTER TEST SET, TRANSFORMERRATIOMETER (SINGLE PHASE), TRANSFORMER RATIOMETER (THREE PHASE), METER TEST KITS, AUTOMATIC HEATER TEST SETS, CAPACITANCE BRIDGES, TEMPERATURE CALIBRATORS, MURRAY LOOP FAULT LOCATORS,CONTACT RESISTANCE TESTERS, A.C. HIGH VOLTAGE TEST SETS, VOLTAGE PHASE SEQUENCE SELECTORS, THREE PHASE SUPPLIES, DIGITAL OHMMETERS, VARIABLE FREQUENCY SUPPLIES AND HIGH VOLTAGE D.C.PULSE FAULT DETECTORS;
MEPT NTN CORPORATION 3-17, Kyomachibori 1-chome Nishi-ku, Osaka-shi Osaka-fu Japan electrical testing instruments; namely, micro-electric power testers;
NTN MEPT NTN CORPORATION 3-17, Kyomachibori 1-chome Nishi-ku, Osaka-shi Osaka-fu Japan electrical testing instruments; namely, micro-electric power testers, voltmeters, galvanometers and rectifying detectors;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. A reusable burn-in/test fixture for testing unsingulated dice on a semiconductor wafer consisting of two halves. The first half of the test fixture is a wafer cavity plate for receiving the wafer, and the second half establishes electrical communication between the wafer and electrical testing equipment. A rigid substrate has conductors thereon which establish electrical contact with the wafer. The test fixture need not be opened until the burn-in and electrical testing are completed. After burn-in stress and electrical testing, it is possible to establish interconnection between the single die or separate and package dice into discrete parts, arrays or clusters, either as singulated parts or as arrays.