ELECTRICALLY CONDUCTIVE ADHESIVES USE

Brand Owner (click to sort) Address Description
DYNALOY MERCK KGAA Frankfurter Str. 250 64293 Darmstadt F128/002 Germany Electrically conductive adhesives for use in the shielding, manufacture and repair of electronic components; electrically conductive coatings for use in the shielding and manufacture of electronic components;Adhesive removers, namely, epoxy removers and cleaners, namely, electronics parts cleaners, flux cleaners, cleaners for molding molds, ink cleaners, stencil cleaners, and polyimide, urethane, silicone and acrylic removers;Solvents, namely, solvent type processing compositions for use in the electronics industry, potting and encapsulation removers, resist removers and strippers, polyimide removers;
DYNALOY Dynaloy 6445 Olivia Lane Indianapolis IN 46226 Electrically conductive adhesives for use in the shielding, manufacture and repair of electronic components; electrically conductive coatings for use in the shielding and manufacture of electronic components;Adhesive removers, namely, epoxy removers and cleaners, namely, electronics parts cleaners, flux cleaners, cleaners for molding molds, ink cleaners, stencil cleaners, and polyimide, urethane, silicone and acrylic removers;Solvents, namely, solvent type processing compositions for use in the electronics industry, potting and encapsulation removers, resist removers and strippers, polyimide removers;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. A disclosed bonded structure includes a first electric structure having a first electrode, a second electric structure having a second electrode, and a middle section for electrically and mechanically bonding the first electrode and the second electrode. The middle section consists of conductive adhesives, wherein fusion bonding of metal particles is provided to at least one of the first electrode and the second electrode. The metal particles are capable of fusion bonding at a temperature lower than a thermal hardening temperature of the conductive adhesives. The conductive adhesives contain conductive filler pieces that have a particle size at which fusion bonding does not take place at a temperature lower than the thermal hardening temperature of the conductive adhesives.