ELECTRICALLY ACTIVATED HEATING PADS

Brand Owner (click to sort) Address Description
BIOWARM LIN, KU-SHEN NO.38, ALLEY 21, LANE 190, SEC 6, MIN-CHUAN E. ROAD TAIPEI Taiwan ELECTRICALLY ACTIVATED HEATING PADS FOR MEDICAL PURPOSES;
CHAKRAS RAINBOW MAT iMedia NY, Inc. 515 7th Avenue New York NY 10018 electrically activated heating pads for medical purposes;
HEALTH AT HOME SUNBEAM PRODUCTS, INC. 2381 Executive Center Drive Boca Raton FL 33431 electrically activated heating pads and heating wraps, and electrically and chemically activated heating wraps with cold packs;
PLATINUM AURA MAT iMedia NY, Inc. 515 7th Avenue New York NY 10018 Electrically activated heating pads for medical purposes;AURA MAT;
PLATINUM MAT iMedia NY, Inc. 515 7th Avenue New York NY 10018 Electrically activated heating pads for medical purposes;MAT;
RAINBOW CHAKRA MAT iMedia NY, Inc. 515 7th Avenue New York NY 10018 Electrically activated heating pads for medical purposes;CHAKRA MAT;
RAINBOW MAT iMedia NY, Inc. 515 7th Avenue New York NY 10018 electrically activated heating pads for medical purposes;
SOFT TOUCH SUNBEAM PRODUCTS, INC. 2381 Executive Center Drive Boca Raton FL 33431 electrically activated heating pads for medical purposes;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. A multi-chip stack package mainly includes a substrate, a first chip, a redistribution structure and at least one second chip. The first chip is disposed on the substrate with an active surface facing upwards. The redistribution structure includes a plurality of first intermediate pads, a plurality of second intermediate pads and a plurality of external pads. The first intermediate pads, the second intermediate pads, and the external pads are formed on the first active surface of the first chip, wherein the first intermediate pads and the second intermediate pads are electrically connected with each other. The second chip is disposed on the redistribution structure, and electrically connected to the first intermediate pads. The second intermediate pads are electrically connected to the substrate through a plurality of bonding wires, so that the second chip and the substrate are electrically conducted, and the connection length of the bonding wires is reduced.