ELECTROCHEMICAL SELECTIVE PLATING RECTIFIERS

Brand Owner Address Description
DALIPACK SIFCO INDUSTRIES, INC. 970 East 64th Street Cleveland OH 44103 electrochemical selective plating rectifiers;DAILY PACK;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. A method of electrochemical deposition (ECD) provides a barrier and a seed layer on a substrate. The surfaces of the substrate are pre-treated before a metal layer is electrochemically deposited thereon in an electrochemical plating cell with a physical or a chemical surface treatment process. The electrochemical plating cell is covered by a cap to prevent evaporation of the electrolyte solution. The electrochemical plating cell includes a substrate holder assembly with a lift seal, e.g., with a contact angle ? less than 90° between the lift seal and the substrate. The substrate holder assembly includes a substrate chuck at the rear side of the substrate.