ELECTRONIC TESTING APPARATUS USE

Brand Owner (click to sort) Address Description
AP3000 TOKYO SEIMITSU CO., LTD 2968-2, Ishikawa-machi, Hachioji-shi Tokyo 192-8515 Japan Electronic testing apparatus for use in the field of manufacturing of semiconductors and their component parts and fittings, namely, probes for testing semiconductors; semiconductor testing apparatus and their component parts and fittings;Semiconductor manufacturing machines;AP THREE ZERO ZERO ZERO; AP THREE THOUSAND;
AP3000E TOKYO SEIMITSU CO., LTD 2968-2, Ishikawa-machi, Hachioji-shi Tokyo 192-8515 Japan Electronic testing apparatus for use in the field of manufacturing of semiconductors and their component parts and fittings, namely, probes for testing semiconductors; semiconductor testing apparatus and their component parts and fittings;Semiconductor manufacturing machines;AP THREE ZERO ZERO ZERO E; AP THREE THOUSAND E;
COMPRION SIMPLIFIER COMPRION GmbH Lise-Meitner-Str. 3 33104 Paderborn Germany Electronic testing apparatus for use in the field of telecommunications, in particular electronic testing apparatus for loading, selecting and modifying user profiles on SIM cards;
TEKSET Perigee Donwood Office Park Liverpool NY 13090 ELECTRONIC TESTING APPARATUS FOR USE IN TESTING CABLE LINES AND EQUIPMENT, NAMELY (SPECIFY NATURE OF EQUIPMENT TESTED AND NATURE OF TESTING CONDUCTED);TEK SET;
Z1805VP TERADYNE, INC. 600 Riverpark Drive North Reading MA 01864 electronic testing apparatus for use in testing electrical properties of connected electrical components;
Z1850VP TERADYNE, INC. 600 Riverpark Drive North Reading MA 01864 electronic testing apparatus for use in testing electrical properties of connected electrical components;2 1850 VP;
Z1880VP TERADYNE, INC. 600 Riverpark Drive North Reading MA 01864 electronic testing apparatus for use in testing electrical properties of connected electrical components;
Z1890VP TERADYNE, INC. 600 Riverpark Drive North Reading MA 01864 electronic testing apparatus for use in testing electrical properties of connected electrical components;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. A method of integration testing for packaged electronic components is capable of improving a conventional testing for packaged electronic components. In this method, non-tested sides of the packaged electronic components are stuck with a downward exposure onto a testing carrier board so that conductive pins are oriented to test spaces to test the plurality of packaged electronic components stuck onto the testing carrier board according to testing steps for convenient classification packaging, advanced testing efficiency, economical working hours and costs. Programmable features and man-hour saving are provided for easy mass production and testing.