ELECTRONIC COMPONENTS BEING PARTS

Brand Owner (click to sort) Address Description
APOS GINTECH ENERGY CORPORATION 8F, NO.396, SEC.1, NEI HU RD. NEI HU DISTRICT TAIPEI Taiwan Electronic components being parts for solar installations, namely, electronic sensors for measuring solar radiation, solar cells, solar collectors, solar heat collection panels; apparatus for converting electronic radiation to electrical energy, namely, photovoltaic solar modules; apparatus for converting electronic radiation to electrical energy, namely, photovoltaic solar-thermal hybrid modules; electric cables, solar cells and photovoltaic solar modules;
APOS APOS ENERGY CORPORATION 8F.-2, NO. 396, SEC.1 NEIHU RD., NEIHU DIST. TAIPEI CITY 114 Taiwan Electronic components being parts for solar installations, namely, electronic sensors for measuring solar radiation, solar cells, solar collectors, solar heat collection panels; apparatus for converting electronic radiation to electrical energy, namely, photovoltaic solar modules; apparatus for converting electronic radiation to electrical energy, namely, photovoltaic solar-thermal hybrid modules; electric cables, solar cells and photovoltaic solar modules;
APOS GINTECH ENERGY CORP. Nei-Hu Technology Park 8F, No. 396, Sec. 1, Neu-Hu Rd. Taiwan Taiwan Electronic components being parts for solar installations, namely, electronic sensors for measuring solar radiation, solar cells, solar collectors, solar heat collection panels; apparatus for converting electronic radiation to electrical energy, namely, photovoltaic solar modules; apparatus for converting electronic radiation to electrical energy, namely, photovoltaic solar-thermal hybrid modules; electric cables, solar cells and photovoltaic solar modules;
EMAT TECHNOLOGY eMAT Technology 8248 Randolph Road NE Moses Lake WA 98837 Electronic components being parts for solar installations, namely, electronic sensors for measuring solar radiation and solar cells; apparatus for converting the chemical energy into the electrical energy, namely, fuel cells; apparatus for storage of the energy, namely, batteries, electric cells; printed wiring boards, liquid crystal display panels and flat panel display screens; apparatus for converting solar radiation to electrical energy, namely, photovoltaic solar modules and photovoltaic solar thermal hybrid modules; metrology equipment for process control in semiconductor manufacturing, namely, titration, voltammetry, chromatography, and spectroscopy;Wet processing equipment used for semiconductor manufacturing, namely, electrodeposition and electroless plating tools; vapor deposition processing equipment used for semiconductor manufacturing, namely, chemical vapor and atomic layer deposition tools;Electronic components being parts for solar installations, namely, solar collectors and solar heat collection panels;TECHNOLOGY;
LEADING THE WAY eMAT Technology 8248 Randolph Road NE Moses Lake WA 98837 Electronic components being parts for solar installations, namely, electronic sensors for measuring solar radiation and solar cells; apparatus for converting the chemical energy into the electrical energy, namely, fuel cells; apparatus for storage of the energy, namely, batteries, electric cells; printed wiring boards, liquid crystal display panels and flat panel display screens; apparatus for converting solar radiation to electrical energy, namely, photovoltaic solar modules and photovoltaic solar thermal hybrid modules; metrology equipment for process control in semiconductor manufacturing, namely, titration, voltammetry, chromatography, and spectroscopy;Wet processing equipment used for semiconductor manufacturing, namely, electrodeposition and electroless plating tools; vapor deposition processing equipment used for semiconductor manufacturing, namely, chemical vapor and atomic layer deposition tools;Electronic components being parts for solar installations, namely, solar collectors and solar heat collection panels;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. An electronic parts built-in substrate of the present invention includes a wiring substrate having connecting pads, a first electronic parts a bump of which is flip-chip connected to the connecting pad, a second electronic parts having a larger area than an area of the first electronic parts a bump of which is flip-chip connected to the connecting pad arranged on an outside of a periphery of the first electronic parts and which is packaged at a predetermined interval over the first electronic parts, and a filling insulating body filled in a clearance between the first electronic parts and the wiring substrate and clearances between the second electronic parts and the first electronic parts and the wiring substrate, wherein the first electronic parts is buried in the filling insulating body.