ELECTROPLATING SERVICES OTHERS

Brand Owner (click to sort) Address Description
ARMOLOY Armoloy Corporation; The 118 Simonds Ave. DeKalb IL 60115 Electroplating Services for Others, Specifically the Electrodeposition of Chromium Particles on Various Metals;Chromium Compounds for Use as an Electrolyte in Electrolytic Plating;
NANOPLATE INTEGRAN TECHNOLOGIES INC. 1 Meridian Road Toronto, Ontario M9W4Z6 Canada ELECTROPLATING SERVICES FOR OTHERS, NAMELY, ELECTROPLATING TO DEPOSIT NANOCRYSTALLINE METALS ON CONDUCTIVE SUBSTRATES;NANOCRYSTALLINE METALLIC ALLOYS FOR USE IN THE MANUFACTURE OF ELECTRONIC COMPONENTS OF METAL; METAL FOILS AND SHEETS WITH A NANOCRYSTALLINE SURFACE; AND ELECTROFORMED STRUCTURAL METAL REINFORCEMENT FOR A METAL TUBE;REPAIR SERVICES, NAMELY, IN SITU ELECTROFORMING OF STRUCTURAL METAL REINFORCEMENT FOR REPAIRING METAL STRUCTURES;NANO PLATE;ELECTRODEPOSITED NANOCRYSTALLINE COATING USED ON ELECTROCONDUCTIVE MATERIALS;
NANOPLATE INTEGRAN TECHNOLOGIES INC. 1 Meridian Road Toronto, Ontario M9W4Z6 Canada ELECTROPLATING SERVICES FOR OTHERS, NAMELY, ELECTROPLATING TO DEPOSIT NANOCRYSTALLINE METALS ON CONDUCTIVE SUBSTRATES;NANOCRYSTALLINE METALLIC ALLOYS FOR USE IN THE MANUFACTURE OF ELECTRONIC COMPONENTS OF METAL; METAL FOILS AND SHEETS WITH A NANOCRYSTALLINE SURFACE; AND ELECTROFORMED STRUCTURAL METAL REINFORCEMENT FOR A METAL TUBE;REPAIR SERVICES, NAMELY, IN SITU ELECTROFORMING OF STRUCTURAL METAL REINFORCEMENT FOR REPAIRING METAL STRUCTURES;ELECTRODEPOSITED NANOCRYSTALLINE COATING USED ON ELECTROCONDUCTIVE MATERIALS;first used in commerce in another form on a date at least as early as 1995;The mark was first used in another form on a date at least as early as July 10, 1995;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. The present invention provides a fountain-type electroplating apparatus with functions of voltage detection and flow rectification, comprising: an electroplating tank, a rectification device, and an overflow tank, wherein the electroplating tank is positioned inside the overflow tank, and the rectification device is arranged under the electroplating tank, in addition, the electroplating tank is composed of a shell, a cathode electrode, and an mesh shaped anode. The apparatus of the present invention further comprises: a power supplier, a switcher, a plurality of detection circuits, and a plurality of connecting line, which is used for monitoring the same.